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On mid Oct 2017, researchers revealed details of a new exploit called KRACK that takes advantage of vulnerabilities in Wi-Fi security to let attackers eavesdrop on traffic between computers and wireless access points.It takes advantage of several key management vulnerabilities in the WPA2 security protocol, the popular authentication scheme used to protect personal and enterprise Wi-Fi networks. Google has already fixed the problem for customers running supported versions of Android version 5,6,7 and 8. The formal patches has already released in 2017-11-06 security patch. The URL is:    Android Security Bulletin—November 2017    And these patches are listed in  chapter 2017-11-06 security patch, System section. Please all i.mx series devices that use the security patch level  earlier than 2017-11-06 must include all applicable patches to fix this wifi vulnerability on Android. Here these patch has been applied for imx Android mm6.0 and ng7.0 release, to avoid this wifi vulnerability, it is recommended to have these patches in this attach applied, which should be applied to external/wpa_supplicant_8.
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These videos demonstrate an example application of a fully cloud-enabled and location-aware mass transport demo built on Freescale's i.MX5x platform with a HD passenger information display, PCAP touch enabled driver control display, and mobilde device (Android phone) integration. The demo showcases how Android provides the potential of significantly shortening the development cycle and accelerating your time-to-market. The demo is based on the Digi ConnectCore i.MX53 System-on-Module solution and was built using our Embedded Application Development Kit for Android (Gingerbread). Smart Tech for Passenger Buses by Digi International - Design West (ESC) 2012 - YouTube - The ARM video interview at Design West Android Bus Demo - YouTube  - The official Digi video overview Visit www.digiembedded.com for additional information, including a special i.MX53 Android Development Kit kit offer for $199. --- VDC Research Awards Digi Best of Show at Embedded World 2012 for Android Application Development Kit with iDigi Device
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We introduced a new modular embedded Linux board running a i.MX6 processor as part of our HIO Project, a development effort backed by HABEY to create expandable modular embedded computer building blocks that can be used across the entire product development cycle, from evaluation, development, prototyping to finish product.  This i.MX6 core-board is a fully functional embedded board that is designed to fit in a 2-gang electrical wall outlet box. Its has eight 50-pin female headers on the top and bottom of the board which allows 3-dimensional expansions by adding modules like building Lego bricks. To showcase this Lego-like modular embedded Linux board design, HABEY launched a Kickstarter campagin (http://kck.st/1HroOaW) that features a i.MX6 POE ready 7” modular in-wall touch computer based on the core-board and two other modules with Yocto embedded Linux or Android. For more information on our modular i.MX 6 solutions, please check http://hioproject.org/ and http://www.habeyusa.com/embedded-arm-boards/
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Horw, Switzerland: Toradex is pleased to announce the availability of a Technical Preview of Windows 10 IoT Core on an ARM-based System on Module (SOM).  The Technical Preview is designed to test and evaluate the new features of Windows 10 IoT Core on an industrial grade embedded computing platform.  To kick start the evaluation, Toradex offers a Starter Kit for a limited time at a promotional price. The kit comes with a Colibri T30 SOM and Iris carrier board plus required accessories. This Technical Preview is based on Colibri T30 powered by NVIDIA ® ’s Tegra 3, a powerful ARM Cortex-A9 Quad Core embedded processor. Colibri T30 supports accelerated DirectX ® graphics, provides low level hardware access, and is part of the Azure IoT Certified Program. Looking at other ARM-based products supporting Windows 10 IoT Core, one key differentiator is that Toradex computer modules are designed to be used in industrial end products. Today, Colibri modules are being deployed successfully in customer applications targeted for Industrial Automation, Medical, Automotive, Point of Sale, Defense and many other verticals. Stephan Dubach, CEO of Toradex AG, said, “Toradex is happy to be able to offer this new IoT platform to embedded developers. It will enable them to take advantage of the Universal Windows Apps and Universal Windows Drivers being portable from big servers down to lean IoT clients. Alongside with the widely known and highly estimated Visual Studio development environment, as well as the added security of Windows 10 IoT Core, and Azure IoT Suite, this platform will allow developers to test and evaluate the capabilities of this new operating system on an industrial platform.” The Technical Preview is limited in terms of features. Over time, Toradex intends to extend features and add Windows 10 IoT Core support for its other ARM-based SOMs, based on customer feedback. Details on the feature limitations can be found at http://developer.toradex.com/winiot and more information on Toradex’s strategy for Windows 10 IoT Core can be found at http://developer.toradex.com/knowledge-base/toradex-windows-10-iot-core-pro-strategy. At the upcoming Embedded World, 2016 on 23 rd -25 th Feb, Toradex will be showing multiple demos on Windows 10 IoT Core and Azure IoT, at booth 1-639, Hall 1. Toradex engineer, Valter Minute, will be giving a talk on “Windows 10 IoT Core: From the Embedded Device to the Cloud and Back”. A recorded webinar on “Introduction to Windows 10 IoT Core” is published at https://www.toradex.com/webinars/introduction-to-windows-10-iot-core. About Toradex: Toradex is a Swiss based company with offices around the world, offering ARM based System on Modules (SOMs) and Customized SBCs. Powered by NXP ® /Freescale i.MX 6, i.MX 7 & Vybrid, and NVIDIA ® Tegra processors, the pin compatible SOMs offer scalability in terms of price, performance, power consumption, and I/Os. Complemented with direct online sales and long-term product availability, Toradex offers direct local premium support and ex-stock availability with locations in Switzerland, USA, India, Brazil, China and Japan.
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Video: http://www.youtube.com/watch?v=gc_YFQ5v_w0 iWave Systems Technologies, an ISO 9001:2008 certified company, established in the year 1999, offers Product Engineering services from concept to market. Today, iWave is one of the leading design houses for Embedded Systems, basically focuses on providing the featured services for Hardware, FPGA and Software, which made this company to deliver the turn-key embedded solutions under one roof. Being in this particular business for long years, iWave has developed rich expertise on ARM architecture based processor platforms and has delivered the robust designs for exciting embedded applications in Industrial, Automotive and Medical domains. Being a certified Silver Partner of Microsoft, iWave provides Windows Embedded Compact BSP to its customers for catering high-end applications.                                                                                                                                                                                                                                                                                                                                                                 iWave has been an innovator in developing highly integrated, high performance, low power and low cost System-On-Modules (SOM) and Development Platforms. The company designs and develops advanced cutting edge products & solutions for its customers using SOMs in the shortest possible time at the most optimized design cost. iWave’s flexible business models for onsite and offshore design support will enable the clients to go for their choice of trade.  Being partnered with the silicon provider Freescale, iWave has worked on many of the ARM based Processors designed by Freescale in its timeline. iWave systems offers Freescale processor based Standard and Proprietory SOMs to meet the market needs for creating innovative end-applications. Also For each of the modules, iWave provides the Development Platforms to facilitate quick software prototyping associated with the Board Support Packages (BSPs) especially for the Linux, Windows Embedded, Android, QNX, VxWorks and iTRON operating systems. Today, we are going to discuss about iWave’s expertise on Freescale processor based products. From the time initial Qseven draft specification was announced, iWave Systems has worked on typical Qseven standard modules based on Freescale processors with generic Qseven carrier board targeting Industrial, Automotive IVI and Medical Applications. i.MX processor based Qseven SOMs: iWave has worked on Freescale’s latest i.MX6 processor based Qseven SOM, with 1GB DDR3 RAM, 2MB SPI flash, 4GB NAND flash and 4GB eMMC flash. It supports Linux, WEC7, and Android operating systems. Freescale’s i.MX51 processor based Qseven SOM from iWave is provided with 128MB DDR2 SDRAM Expandable up to 512MB, NAND Flash of 128MB and supports Linux, Android & WINCE 6.0. Moreover, iWave’s Qseven expertise ranges in delivering the high class Development Platforms like i.MX6 Qseven Development Kit and i.MX51 Qseven development kit. iWave’s Qseven modules offers the best cost & performance solution for many Mobile and Handheld applications. Also, iWave’s Qseven modules provide wide range of features and functions for designing any kind of embedded applications. iWave’s Qseven form factor modules provide fast serial interfaces like PCIe Express, SATA, USB Port, HDMI Display Port, Gigabit Ethernet etc for the high-end developments in designing a product. i.MX processor based MXM System on Modules: Freescale’s latest i.MX6 processor based MXM SOM from iWave comes with a ruggedized MXM connector which provides the carrier board interface to carry all the I/O signals. This module functions with 1GB DDR3 RAM, 2MB SPI flash, 4GB eMMC flash and NAND Flash. It supports Linux and Android operating systems.            iWave has also worked on Freescale's i.MX53 processor based MXM system on module with the automotive temperature grade. This module is provided with 512MB DDR2 RAM, 4GB eMMC Flash, 16MB SPI NOR Flash and supports Linux, Android and WEC7 BSP. With the support for numerous essential interfaces and diverse features, and keeping the main focus on automotive, industrial and medical sectors, these MXM modules are tailored to excel in the performance. i.MX processor based Single Board Computers: The Freescale processor family in iWave has got bigger with the addition of Single Board Computers (SBCs). iWave has developed SBCs based on various Freescale application processors like i.MX6, i.MX50 and i.MX27. They are equipped with all the necessary functions that the embedded world demands on a single board and readily available to deploy in product design. iWave’s i.MX6 Pico ITX SBC measuring just 10cm x 7.2cm, is the industry’s latest Single Board Computer around Freescale’s i.MX6 processor that includes single, dual, and quad-core families based on the ARM Cortex-A9 architecture. This product is iWave’s 4th i.MX6 processor based design and is supplied with 512MB DDR3 RAM, On-board MicroSD slot, Standard SD/SDIO slot, eMMC support, SPI flash etc. It supports Linux, Android and WEC7 BSP. The i.MX50 Quick Start Board (QSB) is a low cost development platform based on Freescale’s i.MX50 processor, which incorporates high performance 800MHz ARM Cortex-A8 processor Electronic Paper Display (EPD) Controller and numerous connectivity options. The i.MX27/ARM9 processor based SBC and Development Platform, helps developers to prototype their applications on Windows CE 6.0, Android and Linux. Around this platform, about 15+ designs have been developed. The SBCs integrate all standard interfaces into a single board providing ultra-compact yet highly integrated platform that can be utilized across multiple embedded PC, system and industrial designs. Apart from these products, iWave specializes in providing complete turnkey design services for system engineering and product development including all hardware and software customized for your applications. iWave has provided complete customized solutions with end applications to several customers and these accomplished projects are successfully serving the purpose of their requirements. iWave’s i.MX SOM modules/services are already being used for variety of applications in focused domains. The company has worked on plenty of fully integrated systems like Digital Signage, Driver Console System, ECG Product Development, Automobile Infotainment, Industrial HMI, Skin Analyser, Video Phone, Quad Display System etc. For more details on all these products and services, kindly visit our website www.iwavesystems.com OR E-mail us on mktg@iwavesystems.com..... Thank you!!
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Freescale’s comprehensive home health hub (HHH) reference platform is designed to speed and ease development for emerging telehealth applications using seamless connectivity and data aggregation to provide remote access and improved healthcare management. It provides multiple connectivity options to obtain data from commercially available wired and wireless healthcare devices such as blood pressure monitors, pulse oximeters, weight scales, blood glucose monitors, etc. The HHH reference platform incorporates broad capabilities so that design engineers have flexibility in their next generation remote monitoring designs. In addition to connectivity for collecting data from healthcare devices, the HHH reference platform also provides connectivity to take action with the collected data by sharing it through a remote smart device with a display such as a tablet, PC or smartphone or through the Cloud. This connectivity gives the person being monitored and caregivers (including family, friends and physicians) a way to track and monitor health status as well as provide alerts and medication reminders. Most importantly, this interface delivers a real-time connection to caregivers to bring ease of mind and offers comfort and safety to the person being monitored. Features Automatic reporting of vital sign measurements Cloud connectivity and secure integration into medical vaults Pervasive mobile device access Daily activity alarms, security alarms and passive monitoring of safety sensors for early detection of injury or security risks Anytime consultation with monitoring center, medical staff, family and friends Anytime and intuitive access to trusted health resources Compelling user interface for a remote display  
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The complete tutorial / FAQs are uploaded to http://www.myirtech.com/faq.asp?selec. The tutorial / FAQs are based on MYIR’s NXP i.MX6UL/6ULL series products but are also applicable to similar products from other companies. MYIR hopes these are useful to you. MYIR’s NXP i.MX6UL/6ULL series products: http://www.myirtech.com/nxpseries.asp MYS-6ULX Single Board Computer MYD-Y6ULX Development Board (MYC-Y6ULX CPU Module as core board) MYD-Y6ULX-HMI Development Board (MYC-Y6ULX CPU Module as core board) MYD-Y6ULX-CHMI Display Panel
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These sockets require significantly more torque to seat than elastomer sockets.
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Open Multimedia UI Composition Engine and Platform   Build custom digital signs, video walls, touch-kiosks and 3D GUIs on the i.MX6 quickly. Lightwing is a scriptable composition and presentation engine for rapidly deploying custom digital signs, interactive touch-kiosks and 3D GUIs on  hardware from many i.MX6 board vendors including the Wandboard Quad, SolidRun Hummingboard and Advantech. Lightwing combines animated 3D objects, audio, video, text, touch controls, live RSS feeds and other dynamic data from the web. Content development and deployment is done using best-in-class open-source tools like ffmpeg, Blender, Notepad++, OpenSSH and WinSCP. Lightwing delivers stunning, high-motion native 3D that grabs attention plus animated text, audio, video, JPEG, PNG images, shader effects and live web content – all without the complexity of web browsers, JavaScript, CSS, HTML5 or Adobe Flash. Lightwing runs on both Windows and Linux. Content is developed on Windows, then deployed to low-cost i.MX6 Linux players over a local network or over the web using secure OpenSSH. Lightwing enables you to directly exploit the GPU and VPU accelerators on the i.MX6 through OpenGL ES 2.0, without the bloat and months of development time required for Qt, Android and browser platforms. Features Native 3D, Images, Audio, Video and Animated Text Built-in Page Transitions, Animations, Fonts and Effects Dynamic Web RSS Feeds and CSV Data Over 100 Image, Video and Font Shader Effects Automatic Content Scaling and Rotation for Display Size Best-in-Class Open Tools – Blender, ffmpeg, WinSCP, etc. Highly Secure Remote Access via OpenSSH Multi-Touch Swipe, Pinch, Zoom and Rotate Gestures Touch Toggle Buttons and Tracking Controls Yocto Open Embedded Linux – Kernel 4.1.15 Highly Portable and Lightweight C++ Applications Digital Signs Interactive Touch-Kiosks Video Walls RSS News Displays Custom 3D GUIs Automotive HMI Lightwing is available on bootable MicroSD cards for individuals and schools and volume licensing for business partners for deployment world-wide. Let’s disrupt your industry! For more information: https://montgomery1.com/lightwing/ 
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The Solution of the Month is the Freescale i.MX6 based Qseven QMX6 a collaboration by Adeneo Embedded and congatec AG Adeneo Embedded is proud to announce its collaboration with congatec on the Freescale i.MX6 based Qseven QMX6 computer-on-module. Congatec is a leading supplier of industrial computer-on-modules supporting the ETX, XTX, COM Express and Qseven form factors.  The conga-QMX6 module was designed to the industry standard Qseven form factor. congatec’s products can be used in a variety of industries and applications, such as industrial automation, medical technology, automotive supplies, aerospace and transportation. Following the design-in phase, customers are given support via extensive product lifecycle management.   Adeneo Embedded has jointly developed and maintains Windows Embedded Compact, Linux and Android BSPs for the conga-QMX6 Qseven module. The combined expertise of both companies on h/w and s/w provides unmatched support to customers in enabling them to move quickly with their designs.   Adeneo Embedded continuously updates the BSP with feature updates and improvements. More information about this product and also other Freescale products supported by Adeneo Embedded can be found at http://www.adeneo-embedded.com/Products/Board-Support-Packages/Congatec-conga-QMX6-BSPs Contact Adeneo Embedded @ sales@adeneo-embedded.com
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Adeneo Embedded once again demonstrates its capacity to develop a strong expertise regarding Windows Embedded Compact 2013.   Feel free to comment !
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Single Board Computers have always enjoyed serious attention in the field of Embedded Systems design. Ever since its introduction, its main intention was to devise a computer to inspire students to take up many new projects to explore the rich and wide world of Embedded Systems. With products like i.MX6 Pico ITX SBC, i.MX50 Quick Start Board, i.MX27 & PXA 270 SBCs, we at iWave Systems, are clearly a global competitor when it comes to promoting powerful ARM Cortex Single Board Computers. i.MX6 Pico ITX SBC: iWave's i.MX6 Dual Lite/Solo based Pico ITX SBC comes with all standard interfaces loaded into a single board with ultra-compact yet highly integrated platform that can be utilized across multiple embedded PC and industrial designs. It also provides an expansion header through which interfaces can be used according to their applications, measuring at just 100mm x 72mm. Pico ITX Advanced Learning Platform: As our product was aimed at inspiring young engineers to take up several projects in the field of Embedded Systems design iWave systems came up with a versatile and well equipped peripheral daughter board which can be plugged to the iWave’s i.MX6 Pico ITX SBC. This peripheral daughter board provides the extension to the I.MX6 Pico ITX board to evaluate several new display, sensor, communication & IO interfaces. The i.MX6 ARM Cortex A9 Pico ITX SBC with peripheral daughter board forms a powerful starter kit for the university students to plug & play several hardware & software components and make many new innovative concepts. The main interfaces supported by peripheral daughter board are as follows: Display Interfaces: A combination of a 7” TFT LCD display, 16x2 Character LCD and a 4 digit 7 segment display for display centric applications. Communication Interfaces: Additional RS232 & CAN ports for standard communication between external devices. Sensor module: Aimed specifically for engineering project works with various sensors like Ambient light sensors, Proximity sensors, Temperature sensor, Accelerometer and Magnetometer Motor Interface: A single driver that is capable of either driving two DC motors or a single Stepper motor Keypad Interface: Keypad scanner and a 4x4 keypad connector support External interfaces: The peripheral daughter board also following several interfaces CMOS camera interface support available on 17x2 row connector MIPI DSI interface support available on 10 pin MIPI connector SPI interface available on 6 pin SPI header Dual UART interface available on the 6 Pin UART header i.MX6 based Pico ITX Educational Kit For more information please contact: mktg@iwavesystems.com Website: www.iwavesystems.com
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Airbus connected factory to shorten Time To Market, Remy’s Martin connected bottle to avoid counterfeit, Schlindler’s elevator smart sensors to improve security, Cisco-IBM connected port in Colombia to enable predictive maintenance, these are some successful examples of B2B IoT creating value and business, and there are many more to come. MACKINSEY ASSESS THAT 70% OF POTENTIAL VALUE ENABLED BY IOT SHOULD COME FROM B2B! McKinsey Global Institute – “The internet of Things: mapping the value beyond the hype” – June 2015 A growing number of companies understand the potential of IoT for B2B markets and its trillions dollars’ revenue expected in 2020 (from 3 to 20 depending on sources and studies). That said, you don’t develop a bluetooth key ring the same way as a sensor designed to monitor temperature in a hot caustic reactor lost in the middle of nowhere and requiring 99,9% availability. While B2C IoT main challenges will remain business application and datamining, B2B brings an additional complexity to the device and its direct environment (gateway, other IoT devices, IT, etc). That is why we make a distinction between the “sexy” IoT focused on B2C and its challenges (marketing, business model, retention, etc.) and what we call the “serious IoT” which is more related to industrial and B2B stakes. This article is the first of a series where I aim to describe the whole process of IoT project development, from a business point of view as well as a technical point of view I will start with this first article by giving what I believe is the best methodology to start a BtoB or Industrial IoT project.   What are the challenges of serious IoT? What are the key success factors to launch a product? What to begin with and which steps to follow? THE FOUR PILARS TO SUCCEED IN AN IoT PROJECT Before I dig into the process to follow, let’s share some key success factors that I’ve identified in all the IoT projects I’ve seen and run: Design thinking As IoT is “hype”, many companies want IoT to launch a project and forget that simple saying: “no pain, no gain”. If there is no pain to be addressed with the project, it will certainly end up in the archive box of the data room. Design thinking allows to have a consumer-centric approach at each stage of the development and ensures your project/product relieves pain, brings a benefit for the customer (even if customer is internal). Master a wide range of technologies MacKinsey assess that system interoperability represent 40% of the potential value of IoT revenue. The “inter” of interoperability means that companies would need partners mastering many different technologies to have all layers/devices work together. In the embedded/IoT world, this can easily exceed 50 technologies (HW architectures, OS, radio & network protocols, frameworks, applications, etc.).  So the success of an IoT project, and more widely of an embedded project, is moving from a technical “silo” expertise to a system approach coupled with technical expertise. Designing the device itself also requires a wide range of expertise and a system approach to optimize the whole system based on business application requirements. Reliable partners (either for technologies or distribution channel) This is often called ‘open innovation’, a term that can freak out CEOs or CTOs. It is simply the fact that you build your project involving partners at each stage to create more value.  As IoT impacts every single bloc of the business model (distribution channel, revenue mode, communication, key activities, key resources, etc.), not a single company can have every related asset internally. So finding the right partners, and sharing value with them, is key to manage and roll-out the project Agile approach This is another “buzz” word. But it is not so obvious for companies not coming from the software industry or coming with a pure embedded software mindset and its 'waterfall approach'. IoT sees many new comers discovering the software challenges, and trying to apply their regular development processes (V cycle for example) to the IoT project. That is the best way to burn it in endless discussions on product scope, spend a lot of money on redeveloping things, and delaying your project launch forever. WHERE AND HOW TO START YOUR IoT PROJECT? Now you’re thinking: “Hmm, interesting, thanks Mr Consultant for this completely un-operational advice. But that doesn’t help me to start”. Don’t you leave now, here is the practical part! These are the first steps to follow when you want to manage an IoT project: 1. START WITH ''WHY'' As Simon Sinek would say, you’d better start with the “why” before launching any useless project. So, why do I want to launch an IoT project? Do I want to launch something that makes my company look trendy and innovative? Do I want to save cost by optimizing my business processes (maintenance, operation, production, etc.)? Do I want to enable new business models into my company offer, thanks to the IoT opportunities (renting vs selling, data value, new services, service vs product, etc.)? Do I want incremental innovation to refresh some of my products? Do I want to use the project as a Trojan horse to digitalize my company? Over the past few years, I have seen all of these motivations among management teams, and all of them are fine. But, you cannot pursue all those goals at the same time, and you certainly won’t design the same project depending on the choice you make. As we say in French “choisir, c’est renoncer” which would translate into something like “Choosing is giving up”. So take time to clearly state your motivations and then select one that needs to guide your focus in the coming months. 2. DESIGN USE CASES AND MAKE ASSUMPTIONS  Easier said than done, but first forget about technology/product, and just think about what IoT could allow in your environment and to which customer this could be most valuable. Draw several customer “journeys” and see where innovation could be used as painkiller or gain creator. Let’s take the example of a maintenance scenario. The idea is the allow remote action for on field devices. For instance, coffee machines installed into gas stations all over Europe. In that case, ask yourself how IoT could make maintenance more efficient? Try to assess time gain, money gain, and security gain and quantify it. Let’s say you identified that among 1000 machines installed, you have a high chance of having 5 customer claims per week and therefore 5 diagnosis to be done per week. Can IoT help you run the diagnosis remotely? Can IoT help you solve the problem remotely? In that case, will that save all on site trips? How much money would that save for the company operating the machines? Knowing that, you can start building a first draft of business models making assumptions: how much of that value can you take? What is the business model you can build around that? How much will it affect your customer process? Have you got the right distribution channel to sell this new offer? Which key assets and activities would you need to bridge the gap between current status and this innovation? 3. GET OUT THE BUILDING Use cases and key assumptions in your pocket, you will now need to go and meet potential customers and partners. The more you share, the more your project will evolve to a credible scenario. Who in your existing base can be your early adopters? Who are your customer having the pain you ease at the highest level (and it is even better if they try to solve it themselves with a workaround). In our example of remote maintenance, they would have some artisanal webcam system on each site to see the machine state and detect some issues without any on-site intervention. Once you’ve identified 5 to 10 contacts, go out and meet them, and try to understand several things : the high level stakes, the problem they have on the field, the way they have tried to solve it, the change process and stakeholder, and then (and only then) you can present your innovation and collect feedbacks. A few slides are enough to present. There is no need for a prototype or any bigger investment. You will be amazed on the quantity of information you can collect that way. And remember something: don’t listen to what people say, look at (or try to understand) what they actually do. 4. BUSINESS MODEL AND FUNCTIONAL SPECIFICATIONS You had your first iteration, congratulations! You wrote down assumptions, you went on the ground to test them, and you collected valuable insights from your targeted customers. Maybe your assumptions proved fully wrong, then go back to stage 2! Otherwise, lucky you, you can write down a v1 of the business model and define your product functional specifications better. This is where you can start defining features, functionalities, prices, offers, channels, technical constraints, cost, financial figures, etc. At the end of this stage you will have some kind of a business plan, a sales pitch, functional specifications, and maybe even technical specifications for your IoT project. 5. POC, POC, POC  That is one of the hardest part of any innovative project: build a Proof Of Concept and test it. Questions are: what are the key features/attributes that I need to test to prove that my concept makes sense for customers? How can I do that as cheap as possible in order to keep my budget for the real product? You’ll need to be very smart, or pay some smart provider, to be able to degrade your end vision so much to just keep the key attributes you want to test. If we go back to the remote maintenance example, can you build some basic software on a Raspberry Pie Board connected to the machine, coupled with a basic web interface that give critical information on the machine, for instance power consumption, run time, temperature, etc. Even if the final product won’t be using raspberry, if you want the web interface to be embedded into an app, and if you want to have twice as much indicators, just focus on the key elements. And test. Doing so, you’ll allow your customer to see real progress, to feel involved in the development process, and to influence the final outcome. And on your side you will collect key information that would take months or even years to collect if you had done it on the real product. A Proof Of Concept can be a functional prototype, or a design prototype, or both. That is pretty much depending on the project and again on the key attributes/functionalities you want to test. 6. ANOTHER LOOP TO COME Congratulation, you’ve made another loop. You are about to become expert in so called “iterative development”! If you don’t feel so, don’t worry as you’ll have many other loops following the same process: make assumptions, test, measure, learn, adjust and make new assumptions, test, measure … Each loop will allow you to adjust the business model, the functional specifications, the customer engagement and go further into your product development. The complete ''Lean startup process'' The key is to keep in mind that your goal here is not to have the perfect product. It is just to be able to learn as much as possible in each loop while spending as less as possible. Make as many loops as you can until you reach a satisfying v1 product brief. But that is for chapter 2… Originally Written on WITEKIO Technical Blog by Samir Bounab, Chief Sales Officer, WITEKIO 15 September 2017
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Future_Electronics_Panel_Interface_ModuleIMG00641 Added by Iain Galloway (Future) on June 22, 2010 at 11:21am   The Future Electronics Panel Interface Module (PIM) allows rapid integration and evaluation of TTL and LVDS LCD panels with the various i.MX EVKs. Easily customized cables provide the ability to mate with LCDs from multiple manufacturers.  
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iWave offers i.MX6 Qseven modules with latest 3.10.17 based Linux kernel with Yocto support. This official Yocto release is based on 3.10.17 kernel. The BSP will support for all the variants of i.MX6 CPU, i.e Quad, Dual, Dual Lite and Solo Qseven modules. The alpha release for the same is now available on request. This release supports the below features on our Qseven Development Platform: Freescale i.MX6 Q/D/DL/S CPU DDR3 SDRAM SPI Boot flash eMMC Flash Debug Console SD Ports USB Ports Ethernet PCIe HDMI 7”LVDS display For further information or enquiries please write to mktg@iwavesystems.com or visit our website www.iwavesystems.com
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Digi Logo Added by Mike Rohrmoser on July 29, 2010 at 7:37pm  
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The complete tutorial / FAQs are uploaded to http://www.myirtech.com/faq.asp?selectm=class&anclassid=6&nclassid=90  The tutorial / FAQs are based on MYIR’s NXP i.MX6UL/6ULL series products but are also applicable to similar products from other companies. MYIR hopes these are useful to you. MYIR’s NXP i.MX6UL/6ULL series products:  MYS-6ULX Single Board Computer MYD-Y6ULX Development Board (MYC-Y6ULX CPU Module as core board) MYD-Y6ULX-HMI Development Board (MYC-Y6ULX CPU Module as core board) MYD-Y6ULX-CHMI Display Panel How to connect Ubuntu to the Internet? Run Oracle VM VirtualBox (this is what I am using, you may use other VirtualBox). Open the settings in the supervisor, choose network, enable network connection, connection type: bridge network card, the name of the interface: Select by actual occurrence. If you want ubuntu to use fixed IP, you may set it up in “Ubuntu/etc/network/interface”. Reference: # interfaces(5) file used by ifup(8) and ifdown(8) auto lo iface lo inet loopback auto enp0s3 iface enp0s3 inet static address 192.168.30.109 netmask 255.255.255.0 getway 192.168.30.1   How to transfer files between Windows PC and the development board? The board and PC should be connected to the same network. Install tftpd64.exe software on the PC. Current Directory, choose the path to upload files. Server interface, choose the IP of PC. Execute “tftp 192.168.1.153 -g -r test.sh” in Xshell when downloading files to the board. Execute “tftp 192.168.1.153 -p -r test.sh” when upload files from the board to PC. 3-3-1 tftpd64 Server configuration How to transfer files between Ubuntu and the development board? The board and Ubuntu should be connected to the same network. Execute scp file to transfer files: “scp -r /home/roy/rs485 root@192.168.1.223:/home/root”. Tips: this command means copy folder ubuntu/home/roy/rs485 to directory /home/root of board with IP 192.168.1.223.
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MYIR launches a 7-inch HMI display panel with capacitive touch screen, the MYD-Y6ULX-CHMI, which runs Linux on NXP’s i.MX6 ULL ARM Cortex-A7 processor, is specially designed for HMI system like POS, intelligent access control and more other applications. It provides many peripheral interfaces and much software resources. Know more at MYD-Y6ULX-CHMI | 7-inch HMI Display Solution based on NXP i.MX 6UL/6ULL-Welcome to MYIR 
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Here's what Adeneo Embedded's engineers are capable of : Fastbooting an OpenGL application on Freescale's i.Mx6q Sabre SD
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http://www.youtube.com/watch?feature=player_embedded&v=Rzm9bF02rIE
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