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Video: http://www.youtube.com/watch?v=gc_YFQ5v_w0 iWave Systems Technologies, an ISO 9001:2008 certified company, established in the year 1999, offers Product Engineering services from concept to market. Today, iWave is one of the leading design houses for Embedded Systems, basically focuses on providing the featured services for Hardware, FPGA and Software, which made this company to deliver the turn-key embedded solutions under one roof. Being in this particular business for long years, iWave has developed rich expertise on ARM architecture based processor platforms and has delivered the robust designs for exciting embedded applications in Industrial, Automotive and Medical domains. Being a certified Silver Partner of Microsoft, iWave provides Windows Embedded Compact BSP to its customers for catering high-end applications.                                                                                                                                                                                                                                                                                                                                                                 iWave has been an innovator in developing highly integrated, high performance, low power and low cost System-On-Modules (SOM) and Development Platforms. The company designs and develops advanced cutting edge products & solutions for its customers using SOMs in the shortest possible time at the most optimized design cost. iWave’s flexible business models for onsite and offshore design support will enable the clients to go for their choice of trade.  Being partnered with the silicon provider Freescale, iWave has worked on many of the ARM based Processors designed by Freescale in its timeline. iWave systems offers Freescale processor based Standard and Proprietory SOMs to meet the market needs for creating innovative end-applications. Also For each of the modules, iWave provides the Development Platforms to facilitate quick software prototyping associated with the Board Support Packages (BSPs) especially for the Linux, Windows Embedded, Android, QNX, VxWorks and iTRON operating systems. Today, we are going to discuss about iWave’s expertise on Freescale processor based products. From the time initial Qseven draft specification was announced, iWave Systems has worked on typical Qseven standard modules based on Freescale processors with generic Qseven carrier board targeting Industrial, Automotive IVI and Medical Applications. i.MX processor based Qseven SOMs: iWave has worked on Freescale’s latest i.MX6 processor based Qseven SOM, with 1GB DDR3 RAM, 2MB SPI flash, 4GB NAND flash and 4GB eMMC flash. It supports Linux, WEC7, and Android operating systems. Freescale’s i.MX51 processor based Qseven SOM from iWave is provided with 128MB DDR2 SDRAM Expandable up to 512MB, NAND Flash of 128MB and supports Linux, Android & WINCE 6.0. Moreover, iWave’s Qseven expertise ranges in delivering the high class Development Platforms like i.MX6 Qseven Development Kit and i.MX51 Qseven development kit. iWave’s Qseven modules offers the best cost & performance solution for many Mobile and Handheld applications. Also, iWave’s Qseven modules provide wide range of features and functions for designing any kind of embedded applications. iWave’s Qseven form factor modules provide fast serial interfaces like PCIe Express, SATA, USB Port, HDMI Display Port, Gigabit Ethernet etc for the high-end developments in designing a product. i.MX processor based MXM System on Modules: Freescale’s latest i.MX6 processor based MXM SOM from iWave comes with a ruggedized MXM connector which provides the carrier board interface to carry all the I/O signals. This module functions with 1GB DDR3 RAM, 2MB SPI flash, 4GB eMMC flash and NAND Flash. It supports Linux and Android operating systems.            iWave has also worked on Freescale's i.MX53 processor based MXM system on module with the automotive temperature grade. This module is provided with 512MB DDR2 RAM, 4GB eMMC Flash, 16MB SPI NOR Flash and supports Linux, Android and WEC7 BSP. With the support for numerous essential interfaces and diverse features, and keeping the main focus on automotive, industrial and medical sectors, these MXM modules are tailored to excel in the performance. i.MX processor based Single Board Computers: The Freescale processor family in iWave has got bigger with the addition of Single Board Computers (SBCs). iWave has developed SBCs based on various Freescale application processors like i.MX6, i.MX50 and i.MX27. They are equipped with all the necessary functions that the embedded world demands on a single board and readily available to deploy in product design. iWave’s i.MX6 Pico ITX SBC measuring just 10cm x 7.2cm, is the industry’s latest Single Board Computer around Freescale’s i.MX6 processor that includes single, dual, and quad-core families based on the ARM Cortex-A9 architecture. This product is iWave’s 4th i.MX6 processor based design and is supplied with 512MB DDR3 RAM, On-board MicroSD slot, Standard SD/SDIO slot, eMMC support, SPI flash etc. It supports Linux, Android and WEC7 BSP. The i.MX50 Quick Start Board (QSB) is a low cost development platform based on Freescale’s i.MX50 processor, which incorporates high performance 800MHz ARM Cortex-A8 processor Electronic Paper Display (EPD) Controller and numerous connectivity options. The i.MX27/ARM9 processor based SBC and Development Platform, helps developers to prototype their applications on Windows CE 6.0, Android and Linux. Around this platform, about 15+ designs have been developed. The SBCs integrate all standard interfaces into a single board providing ultra-compact yet highly integrated platform that can be utilized across multiple embedded PC, system and industrial designs. Apart from these products, iWave specializes in providing complete turnkey design services for system engineering and product development including all hardware and software customized for your applications. iWave has provided complete customized solutions with end applications to several customers and these accomplished projects are successfully serving the purpose of their requirements. iWave’s i.MX SOM modules/services are already being used for variety of applications in focused domains. The company has worked on plenty of fully integrated systems like Digital Signage, Driver Console System, ECG Product Development, Automobile Infotainment, Industrial HMI, Skin Analyser, Video Phone, Quad Display System etc. For more details on all these products and services, kindly visit our website www.iwavesystems.com OR E-mail us on mktg@iwavesystems.com..... Thank you!!
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英国是大多数留学生向往的留学深造目的地之一,(【联系方式QQ-1252839746】当面临诸多例如:Probation、Withdrawal、Suspension、Dismissal、等学术警告问题的时候,很多学生选择了联系我们修改成绩单达到学分GPA要求或删除学术不良记录重新回到学校。)很多留学生在美国学习后都学到了很多知识,成长为更好的自己。但是,在学习过程中,难免遇到磕磕绊绊,比如:刚来到美国会遇到Culture shock(文化冲突);刚入学会听不懂老师的授课内容;生活上出现各种不可预期的困难;mid-term和final期间没日没夜地复习。历练中,很多学生成功克服困难,顺利完成学业,但也有一部分学生面对过 停学 ( Suspension )的尴尬。不过幸好美国愿意给犯错的学生二次入学的机会,并专门针对停学及开除学生提供一个申请流程,称为 Readmission (再次申请录取)。被停学的学生可以曲线救国,最终成功回到原来的校园。 学生被美国学校停学的理由有很多,例如作弊被抓丶GPA低丶违反校规丶代写代考被发现等等。在达到相应严重程度时,学校会给予学生短则一个季度或一个学期,长则一年甚至两年以上的停学处分。在被停学后,大多数学生都想在停学结束后重新回到原学校。那么学生就会面临 Readmission(重新申请录取/重新接纳)的情况。 T同学是美国某大学大二的学生,在被学校停学后,选择了回国待一年。但是当T同学在结束一年的停学后,提出 Readmission 想要重回学校时,学校却拒绝了T同学的请求,T同学一头雾水。 其实 Readmission 时,需要注意的细节有很多,但是大家往往忽略了这些重要内容。下面我们来详细讲解一下跟原学校申请再次录取的注意事项: 各大学对Readmission要求都不同 首先,学生被 停学 ( Suspension )后,学校对于Readmission有着不同程度的入学要求: 1丶停学期限一到,有的学校是无过多要求,直接颁发新的I-20让学生回到学校,这也是最轻松的Readmission。停学期间,学生需要进行一定的自我反省,并积极调整学习方法和学习知识。 2丶也有一部分的学校对再次申请入学是有要求的,涉及到学生需要在反省后,向学校提交Readmission申请表格及个人陈述,审核通过后,学生才能回到学校。 3丶最难的Readmission是学校要求学生重新入学前进行自我完善和提高,例如进行本学校暑期课程的学习或者在其他机构的学习,证明自己是有继续在原学校读书的能力同时可能会要求提供一些额外的支持材料。 申请时间有限制 学生需要仔细研究学校的开始申请日期和截止日期,并及时提交相关材料。如果错过了申请的时间,学生可能会错过重新入学的学期。T同学就是因为没有注意到截止时间,没有及时提交学校要求的材料,导致Readmission阶段仍需要进行二次申请。 停学期间不要贪图玩耍 建议学生停学期间不要回国。很多学生在国内把停学当作放假,各地游玩儿,在家打游戏,吃喝玩乐。这样极其不利于Readmission的申请,重新回到原学校的机率也会降低。 Readmission申请有风险 并不是所有申请Readmission的学生都会通过。学校对于每一位Readmission的学生都会严格的考量。包括学生停学期间的表现和回国态度,重新入学的提交材料审核等,如被认为不具有继续在原学校读书能力的学生有被拒风险。 当面临诸多例如:Probation、Withdrawal、Suspension、Dismissal、等学术警告问题的时候,很多学生选择了联系我们修改成绩单达到学分GPA要求或删除学术不良记录重新回到学校。【联系方式QQ-1252839746】
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Freescale’s comprehensive home health hub (HHH) reference platform is designed to speed and ease development for emerging telehealth applications using seamless connectivity and data aggregation to provide remote access and improved healthcare management. It provides multiple connectivity options to obtain data from commercially available wired and wireless healthcare devices such as blood pressure monitors, pulse oximeters, weight scales, blood glucose monitors, etc. The HHH reference platform incorporates broad capabilities so that design engineers have flexibility in their next generation remote monitoring designs. In addition to connectivity for collecting data from healthcare devices, the HHH reference platform also provides connectivity to take action with the collected data by sharing it through a remote smart device with a display such as a tablet, PC or smartphone or through the Cloud. This connectivity gives the person being monitored and caregivers (including family, friends and physicians) a way to track and monitor health status as well as provide alerts and medication reminders. Most importantly, this interface delivers a real-time connection to caregivers to bring ease of mind and offers comfort and safety to the person being monitored. Features Automatic reporting of vital sign measurements Cloud connectivity and secure integration into medical vaults Pervasive mobile device access Daily activity alarms, security alarms and passive monitoring of safety sensors for early detection of injury or security risks Anytime consultation with monitoring center, medical staff, family and friends Anytime and intuitive access to trusted health resources Compelling user interface for a remote display  
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Adeneo Embedded once again demonstrates its capacity to develop a strong expertise regarding Windows Embedded Compact 2013.   Feel free to comment !
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Added by eric on November 4, 2011 at 1:52am Hi~~We're HW provider. contact with me. eric@campro-cctv.com
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Adeneo Embedded achieved the porting of a Irrlicht 3D engine demo application onto a Phytec i.MX6 development board. Check out the cool features of the demo on the video ! Don't forget to subscribe, comment and share
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Only 2″X2″ Endless Possibilities. Solid-Run's CuBox-i is the second generation family of mini computers, based on the scalable Freescale i.MX6 family of system-on-chip (SoC) ranging from a single to quad Cortex-A9 processor cores, 2D/3D hardware graphics processing unit, video decoding and encoding acceleration hardware, HDMI 1080p 3D broad range of peripherals. Read more about CuBox-i
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This video is showing the BCM AR6MXQ i.MX6 Cortex A9 Quad Core ARM Motherboard running with Linux OS and playing two different HD contents on dual screen
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Added by Ramona Maurer on June 1, 2012 at 10:24am QNX 6.5 is running on our DIMM-MX53 module, also available as Developer Kit
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e-con Systems announces their new System-On-Module aimed for Applications which require higher GPU performance and faster network connectivity. eSOMiMX6PLUS System-On-Module is based on NXP’s QuadPLUS/DualPLUS ARM Cortex™ A9 Processor running up to 1.2GHz, featuring 3 high speed Camera interfaces with support for 13MP Camera and supporting 802.11 ac Wi-Fi network. The eSOMiMX6PLUS at volumes is available at USD79 onwards and samples can be bought from the Webstore. Customers wanting to evaluate thee SOMiMX6PLUS, can do so by ordering the AnkaaPLUS development kit from e-con’s Webstore. The development kit, among other accessories, also includes a13MP camera board, 5MP camera board and 7” LCD panel. 
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iWave has proudly expanded its product range with the announcement of latest i.MX6UL SODIMM SOM, i.e RainboW-G18M, which integrates the power efficient high performance ARM Cortex A7 based Freescale’s i.MX6UL CPU core operating up to 528MHz speed. The i.MX6UL SODIMM module is ultra-compact in size measuring just 67.6 x 29mm, and is ideally suitable for very low power cost optimized embedded applications. In such a small form-factor, this module supports plenty of features. The i.MX6UL module is equipped with 256MB of DDR3 RAM, which is expandable upto 1GB. 256MB of NAND flash is supported on the SOM which is also expandable. This SOM is integrated with on-board PF3000 PMIC and dual Ethernet PHY. All the IO peripheral interfaces are supported by i.MX6UL SOC, which is available via the 200 pin SODIMM edge connector. To support the new designs based on this i.MX6UL module, iWave has also announced i.MX6UL SODIMM Development Kit, which includes i.MX6UL CPU based SODIMM SOM and a carrier board. It's an ideal platform to get started with the i.MX6UL device for quick time to market. This module supports two USB ports, Micro SD, 24 bit RGB display, 8-bit parallel camera ports, I2S audio or JTAG header, Debug UART, two CAN ports, two UART, PWM interface, I2C and GPIOs. The i.MX6UL SOM is intended for various applications including but not limited to Industrial HMI, Access Control, Mobile POS, IOT Gateway, Wearable devices, Secure e-commerce, Energy management, Industrial Control & Automation, Medical & Healthcare devices, White goods & Smart appliances.  The i.MX6UL SODIMM Development Kit will be available for shipping from the start of Q4-2015 with Linux BSP. So order today! For more details on this product, please visit our website www.iwavesystems.com OR E-mail us on mktg@iwavesystems.com  Thank you!!
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Airbus connected factory to shorten Time To Market, Remy’s Martin connected bottle to avoid counterfeit, Schlindler’s elevator smart sensors to improve security, Cisco-IBM connected port in Colombia to enable predictive maintenance, these are some successful examples of B2B IoT creating value and business, and there are many more to come. MACKINSEY ASSESS THAT 70% OF POTENTIAL VALUE ENABLED BY IOT SHOULD COME FROM B2B! McKinsey Global Institute – “The internet of Things: mapping the value beyond the hype” – June 2015 A growing number of companies understand the potential of IoT for B2B markets and its trillions dollars’ revenue expected in 2020 (from 3 to 20 depending on sources and studies). That said, you don’t develop a bluetooth key ring the same way as a sensor designed to monitor temperature in a hot caustic reactor lost in the middle of nowhere and requiring 99,9% availability. While B2C IoT main challenges will remain business application and datamining, B2B brings an additional complexity to the device and its direct environment (gateway, other IoT devices, IT, etc). That is why we make a distinction between the “sexy” IoT focused on B2C and its challenges (marketing, business model, retention, etc.) and what we call the “serious IoT” which is more related to industrial and B2B stakes. This article is the first of a series where I aim to describe the whole process of IoT project development, from a business point of view as well as a technical point of view I will start with this first article by giving what I believe is the best methodology to start a BtoB or Industrial IoT project.   What are the challenges of serious IoT? What are the key success factors to launch a product? What to begin with and which steps to follow? THE FOUR PILARS TO SUCCEED IN AN IoT PROJECT Before I dig into the process to follow, let’s share some key success factors that I’ve identified in all the IoT projects I’ve seen and run: Design thinking As IoT is “hype”, many companies want IoT to launch a project and forget that simple saying: “no pain, no gain”. If there is no pain to be addressed with the project, it will certainly end up in the archive box of the data room. Design thinking allows to have a consumer-centric approach at each stage of the development and ensures your project/product relieves pain, brings a benefit for the customer (even if customer is internal). Master a wide range of technologies MacKinsey assess that system interoperability represent 40% of the potential value of IoT revenue. The “inter” of interoperability means that companies would need partners mastering many different technologies to have all layers/devices work together. In the embedded/IoT world, this can easily exceed 50 technologies (HW architectures, OS, radio & network protocols, frameworks, applications, etc.).  So the success of an IoT project, and more widely of an embedded project, is moving from a technical “silo” expertise to a system approach coupled with technical expertise. Designing the device itself also requires a wide range of expertise and a system approach to optimize the whole system based on business application requirements. Reliable partners (either for technologies or distribution channel) This is often called ‘open innovation’, a term that can freak out CEOs or CTOs. It is simply the fact that you build your project involving partners at each stage to create more value.  As IoT impacts every single bloc of the business model (distribution channel, revenue mode, communication, key activities, key resources, etc.), not a single company can have every related asset internally. So finding the right partners, and sharing value with them, is key to manage and roll-out the project Agile approach This is another “buzz” word. But it is not so obvious for companies not coming from the software industry or coming with a pure embedded software mindset and its 'waterfall approach'. IoT sees many new comers discovering the software challenges, and trying to apply their regular development processes (V cycle for example) to the IoT project. That is the best way to burn it in endless discussions on product scope, spend a lot of money on redeveloping things, and delaying your project launch forever. WHERE AND HOW TO START YOUR IoT PROJECT? Now you’re thinking: “Hmm, interesting, thanks Mr Consultant for this completely un-operational advice. But that doesn’t help me to start”. Don’t you leave now, here is the practical part! These are the first steps to follow when you want to manage an IoT project: 1. START WITH ''WHY'' As Simon Sinek would say, you’d better start with the “why” before launching any useless project. So, why do I want to launch an IoT project? Do I want to launch something that makes my company look trendy and innovative? Do I want to save cost by optimizing my business processes (maintenance, operation, production, etc.)? Do I want to enable new business models into my company offer, thanks to the IoT opportunities (renting vs selling, data value, new services, service vs product, etc.)? Do I want incremental innovation to refresh some of my products? Do I want to use the project as a Trojan horse to digitalize my company? Over the past few years, I have seen all of these motivations among management teams, and all of them are fine. But, you cannot pursue all those goals at the same time, and you certainly won’t design the same project depending on the choice you make. As we say in French “choisir, c’est renoncer” which would translate into something like “Choosing is giving up”. So take time to clearly state your motivations and then select one that needs to guide your focus in the coming months. 2. DESIGN USE CASES AND MAKE ASSUMPTIONS  Easier said than done, but first forget about technology/product, and just think about what IoT could allow in your environment and to which customer this could be most valuable. Draw several customer “journeys” and see where innovation could be used as painkiller or gain creator. Let’s take the example of a maintenance scenario. The idea is the allow remote action for on field devices. For instance, coffee machines installed into gas stations all over Europe. In that case, ask yourself how IoT could make maintenance more efficient? Try to assess time gain, money gain, and security gain and quantify it. Let’s say you identified that among 1000 machines installed, you have a high chance of having 5 customer claims per week and therefore 5 diagnosis to be done per week. Can IoT help you run the diagnosis remotely? Can IoT help you solve the problem remotely? In that case, will that save all on site trips? How much money would that save for the company operating the machines? Knowing that, you can start building a first draft of business models making assumptions: how much of that value can you take? What is the business model you can build around that? How much will it affect your customer process? Have you got the right distribution channel to sell this new offer? Which key assets and activities would you need to bridge the gap between current status and this innovation? 3. GET OUT THE BUILDING Use cases and key assumptions in your pocket, you will now need to go and meet potential customers and partners. The more you share, the more your project will evolve to a credible scenario. Who in your existing base can be your early adopters? Who are your customer having the pain you ease at the highest level (and it is even better if they try to solve it themselves with a workaround). In our example of remote maintenance, they would have some artisanal webcam system on each site to see the machine state and detect some issues without any on-site intervention. Once you’ve identified 5 to 10 contacts, go out and meet them, and try to understand several things : the high level stakes, the problem they have on the field, the way they have tried to solve it, the change process and stakeholder, and then (and only then) you can present your innovation and collect feedbacks. A few slides are enough to present. There is no need for a prototype or any bigger investment. You will be amazed on the quantity of information you can collect that way. And remember something: don’t listen to what people say, look at (or try to understand) what they actually do. 4. BUSINESS MODEL AND FUNCTIONAL SPECIFICATIONS You had your first iteration, congratulations! You wrote down assumptions, you went on the ground to test them, and you collected valuable insights from your targeted customers. Maybe your assumptions proved fully wrong, then go back to stage 2! Otherwise, lucky you, you can write down a v1 of the business model and define your product functional specifications better. This is where you can start defining features, functionalities, prices, offers, channels, technical constraints, cost, financial figures, etc. At the end of this stage you will have some kind of a business plan, a sales pitch, functional specifications, and maybe even technical specifications for your IoT project. 5. POC, POC, POC  That is one of the hardest part of any innovative project: build a Proof Of Concept and test it. Questions are: what are the key features/attributes that I need to test to prove that my concept makes sense for customers? How can I do that as cheap as possible in order to keep my budget for the real product? You’ll need to be very smart, or pay some smart provider, to be able to degrade your end vision so much to just keep the key attributes you want to test. If we go back to the remote maintenance example, can you build some basic software on a Raspberry Pie Board connected to the machine, coupled with a basic web interface that give critical information on the machine, for instance power consumption, run time, temperature, etc. Even if the final product won’t be using raspberry, if you want the web interface to be embedded into an app, and if you want to have twice as much indicators, just focus on the key elements. And test. Doing so, you’ll allow your customer to see real progress, to feel involved in the development process, and to influence the final outcome. And on your side you will collect key information that would take months or even years to collect if you had done it on the real product. A Proof Of Concept can be a functional prototype, or a design prototype, or both. That is pretty much depending on the project and again on the key attributes/functionalities you want to test. 6. ANOTHER LOOP TO COME Congratulation, you’ve made another loop. You are about to become expert in so called “iterative development”! If you don’t feel so, don’t worry as you’ll have many other loops following the same process: make assumptions, test, measure, learn, adjust and make new assumptions, test, measure … Each loop will allow you to adjust the business model, the functional specifications, the customer engagement and go further into your product development. The complete ''Lean startup process'' The key is to keep in mind that your goal here is not to have the perfect product. It is just to be able to learn as much as possible in each loop while spending as less as possible. Make as many loops as you can until you reach a satisfying v1 product brief. But that is for chapter 2… Originally Written on WITEKIO Technical Blog by Samir Bounab, Chief Sales Officer, WITEKIO 15 September 2017
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The MYS-6ULX Single Board Computer is powered by 528MHz NXP i.MX 6UltraLite / 6ULL ARM Cortex-A7 Processor, with 256MB DDR3, 256MB Nand Flash on board. This video briefly introduced the features and peripherals on the IoT board and IND board. Know more at http://www.myirtech.com/list.asp?id=561
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3a Added by Ruslan on June 15, 2012 at 12:29pm    
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The wait is over! Toradex announces the launch of its latest technical support feature, the Toradex Community, an online community that aims to provide customers a unique platform to stay connected with the Toradex engineers. Toradex, which has always provided extensive free and direct technical support from development engineers, recognizes that many of its customers often have similar queries. By providing an online community where anyone may post a query and by publicly listing down the engineers’ responses, Toradex anticipates that the entire community will stand to benefit from the collective knowledge available via the forum. “We invested a lot of time to understand what information our customers most wanted access to and how to deliver it in a simplified, user friendly and timely manner. With the launch of the Toradex Community platform, our aim is to create an even more connected and responsive support system for our customers, while enabling easy access to information. We invite you to be a part of this ever-growing community constituted by our embedded enthusiasts.” said Roman Schnarwiler, CTO, Toradex. The community will serve to provide its members with sustainable solutions and key insights from our experienced engineers who will be answering queries related to the usage of Toradex products in a wide variety of embedded applications. Furthermore, it will complement the exhaustive information available on the Toradex Developer Center, which is a resourceful website that brings all of Toradex’s developer resources together at one place. For an overview about all our available support channels, please check our support page. About Toradex: Toradex is a leading vendor of ARM based System on Modules (SOMs) that can be used for diverse embedded applications. Powered by Freescale® i.MX 6 & Vybrid™, NVIDIA® Tegra, and other leading processors, the SOM families offer a wide range of options in terms of price, performance, power consumption and interfaces. Complemented with the long-term availability of 10+ years for its products, Toradex stands out in the embedded computing market with free lifetime product maintenance, pin-compatible product families for scalable designs, direct premium technical support, and transparent pricing with direct online sales. Founded in 2003 and headquartered in Horw, Switzerland, the company’s network stretches across the globe with additional offices in the USA, Vietnam, China, India, Japan, and Brazil. For more information, visit https://www.toradex.com. For media queries, please contact: Lakshmi Naidu: lakshmi.naidu@toradex.com
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'Multi-core Processor Technology’ will be the key in the development of next generation of advanced computing devices. With major silicon vendor Freescale bringing multi-core application processors for the mainstream embedded devices, there is  need to have the multi-core processing support in the embedded operating systems. Windows Embedded Compact 7(WEC7) will enhance the performance of ARM based multi-core platforms with the addition of Symmetric Multi-Processing (SMP) support. iWave systems has done a SMP support verification on its Freescale’s i.MX6 Quad core processor running WEC7 platform. Symmetric Multi-Processing (SMP) support in WEC7: The most important update in the Windows Embedded Compact 7 is the support for Symmetric Multi-Processing (SMP) which takes the full advantage of multi-core systems providing a performance boost when the multithreaded applications are being used. The multi-core processor platforms such as Freescale’s i.MX6Q which has 4 identical CPU cores, can effectively take advantage of SMP support in WEC7. SMP enabled kernel can use several CPU cores simultaneously and distribute the execution of different processes and threads to them. The number of available cores can be determined by SMP API from the application – the processing and assignment of a thread to a specially selected core is also possible. Read More.. Windows Embedded Compact7 on i.MX6 RainboW-G15D Development Board: iWave Systems, profoundly known for its genuine embedded solution offerings spanning from SOMs to fully integrated systems, offers Windows Embedded Compact 7 (WEC7) reference BSP for iWave’s i.MX6 platform named RainboW G15D besides the existing Linux & Android BSP versions. All the latest features that WEC7 offers such as Silverlight 3.0, MPEG-4 HD, Expression Blend, Active Sync and also Adobe Flash10.1 are made available. About i.MX6 Qseven Development Board: The Development Platform incorporates Qseven compatible i.MX6x SOM which is based on Freescale's iMX 6 Series 1.2GHz multimedia focused processor and Generic Q7 compatible Evaluation Board. This platform can be used for quick prototyping of any high end applications in verticals like Automotive, Industrial & Medical. Being a nano ITX form factor with 120mmx120mm size, the board is highly packed with all necessary on-board connectors to validate complete iMX6 CPU features. About iWave Systems: iWave has been an innovator in the development of “Highly integrated, high-performance, low-power and low-cost i.MX6/i.MX50/i.MX53/i.MX51/i.MX27 SOMs”. iWave helps its customers reduce their time-to-market and development effort with its products ranging from System-On-Module to complete systems. The i.MX6 Pico ITX SBC is brought out by iWave in a record time of just 5 weeks. Furthermore, iWave’s i.MX6/i.MX50/i.MX53/i.MX51/i.MX27 SOMs have been engineered to meet the industry demanding requirements like various Embedded Computing Applications in Industrial, Medical & Automotive verticals. iWave provides full product design engineering and manufacturing services around the i.MX SOMs to help customers quickly develop innovative products and solutions. For more details: WEC7 on i.MX6 Rainbow G15D  | iWave Systems email: mktg@iwavesystems.com
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Hi, check out one of our latest demo video hightlighting the capabilities of the i.mx6 SoloX SDB running Embedded Linux + a full screen Qt 5.4 application.
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The complete tutorial / FAQs are uploaded to http://www.myirtech.com/faq.asp?selectm=class&anclassid=6&nclassid=90  The tutorial / FAQs are based on MYIR’s NXP i.MX6UL/6ULL series products but are also applicable to similar products from other companies. MYIR hopes these are useful to you. MYIR’s NXP i.MX6UL/6ULL series products:  MYS-6ULX Single Board Computer MYD-Y6ULX Development Board (MYC-Y6ULX CPU Module as core board) MYD-Y6ULX-HMI Development Board (MYC-Y6ULX CPU Module as core board) MYD-Y6ULX-CHMI Display Panel How to connect Ubuntu to the Internet? Run Oracle VM VirtualBox (this is what I am using, you may use other VirtualBox). Open the settings in the supervisor, choose network, enable network connection, connection type: bridge network card, the name of the interface: Select by actual occurrence. If you want ubuntu to use fixed IP, you may set it up in “Ubuntu/etc/network/interface”. Reference: # interfaces(5) file used by ifup(8) and ifdown(8) auto lo iface lo inet loopback auto enp0s3 iface enp0s3 inet static address 192.168.30.109 netmask 255.255.255.0 getway 192.168.30.1   How to transfer files between Windows PC and the development board? The board and PC should be connected to the same network. Install tftpd64.exe software on the PC. Current Directory, choose the path to upload files. Server interface, choose the IP of PC. Execute “tftp 192.168.1.153 -g -r test.sh” in Xshell when downloading files to the board. Execute “tftp 192.168.1.153 -p -r test.sh” when upload files from the board to PC. 3-3-1 tftpd64 Server configuration How to transfer files between Ubuntu and the development board? The board and Ubuntu should be connected to the same network. Execute scp file to transfer files: “scp -r /home/roy/rs485 root@192.168.1.223:/home/root”. Tips: this command means copy folder ubuntu/home/roy/rs485 to directory /home/root of board with IP 192.168.1.223.
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i.mx233 Computer on Module Added by Lucas Loizaga on August 1, 2010 at 5:03pm First 3D image of our i.mx233 SODIMM CoM!  
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