Hi Ivan,
Thank you for your reply.
The recommendations in the HW design guide (EVK) for the net NVCC_NAND, NVCC_SAI1, NVCC_SAI3, NVCC_SAI5, NVCC_ECSPI, VCC_USB_3P3 is 5x220nF and 1x4.7uF. On the other hand for the net NVCC_JTAG, NVCC_SAI2, NVCC_GPIO1, NVCC_I2C, NVCC_UART, NVCC_SD1, NVCC_CLK only 3x220nF and 1x10uF is recommended. That means your rule of thumb unfurtunatly does not work. For us it is very important that the processor is working reliable over a wide temperature range (-40°C to +85°C).
For an Altera FPGA power design there is a tool available (see attachment) to make a PDN analysis to determine the decoupling capacitors. Is there a tool or a design guide available for the i.MX8M Mini to determine the decoupling capacitors?
Best Regards,
Patrick