Greetings,
We're working on iMX53 based board, running Windows CE. We have a requirement for UID (Unique ID), to identify each board.
There's a code in place already to read UID as in here: Easy Way to Read UID(Unique ID) on i.MX53
The problem is that we also have a requirement for this UID to be easily read by human. Clearly, 64 bit number is not that easy to communicate over the phone.
iMX53 manual says that "
42.2.1.2 Fuse Bank 0
Fuse Bank 0 contains manufacturing information such as Unique ID (UID), consists of fab ID, lot and wafer number, and die coordinates.
"
We thought of splitting ID, or skipping certain bytes. But for that we need to know the structure of UNIQUE_ID.
What are offsets of " fab ID, lot and wafer number, and die coordinates", respectively, inside 64-bit UNIQUE_ID value?
Thanks in advance
Dmitriy Lisovenko
Solved! Go to Solution.
0820 | DIE-X-CORDINATE[7:0] / UNIQUE_ID[63:56] ) | |||||||
0824 | DIE-Y-CORDINATE[7:0] / UNIQUE_ID[55:48] ) | |||||||
0828 | WAFER_NO[4:0] / UNIQUE_ID[47:43] ) | | LOT_NO_ENC[42:40] | ||||||
082C | LOT_NO_ENC[39:32] / UNIQUE_ID[39:32] ) | |||||||
0830 | LOT_NO_ENC[31:24] / UNIQUE_ID[31:24] ) | |||||||
0834 | LOT_NO_ENC[23:16] / UNIQUE_ID[23:16] ) | |||||||
0838 | LOT_NO_ENC[15:8] / UNIQUE_ID[15:8] ) | |||||||
083C | LOT_NO_ENC[7:0] / UNIQUE_ID[7:0] ) |
Also please use Table 7-2 (Boot eFUSE Descriptions) of the i.MX53 RM.
0820 | DIE-X-CORDINATE[7:0] / UNIQUE_ID[63:56] ) | |||||||
0824 | DIE-Y-CORDINATE[7:0] / UNIQUE_ID[55:48] ) | |||||||
0828 | WAFER_NO[4:0] / UNIQUE_ID[47:43] ) | | LOT_NO_ENC[42:40] | ||||||
082C | LOT_NO_ENC[39:32] / UNIQUE_ID[39:32] ) | |||||||
0830 | LOT_NO_ENC[31:24] / UNIQUE_ID[31:24] ) | |||||||
0834 | LOT_NO_ENC[23:16] / UNIQUE_ID[23:16] ) | |||||||
0838 | LOT_NO_ENC[15:8] / UNIQUE_ID[15:8] ) | |||||||
083C | LOT_NO_ENC[7:0] / UNIQUE_ID[7:0] ) |
Also please use Table 7-2 (Boot eFUSE Descriptions) of the i.MX53 RM.