We consider PCB design with IMX6POP(IMX6DQCPOPEC).
We need below answers asap.
Section 3.18 of the HW Design Guide indicates that when using a POP product,
the impedance of the VIA of the build-up board is
It becomes dominant, it can not be satisfied by becoming a value about three times the standard.
So please let us ask the question below.
1. Below, We think that it is regulation in the simulation of reference board which is not POP item
Could you please tell us the criteria for POP items?
2. If the following can not be fulfilled, please tell us if there is any other solution.
■ Hardware Development Guide for i.MX 6QuadPlus, 6Quad, 6DualPlus, 6Dual, 6DualLite, 6Solo Families of Applications Processors
IMX6DQ6SDLHDG Rev. 2 10/2016
P.68
3.18 Guideline for power net electrical performance
The graph is provided as impedance guidance for the various power nets relative to ground.
NXP recommends that a user’s board be at or below the impedances curves shown. For example,
consider the 100 MHz point on the VDD_ARM_CAP curve at 0.065 ohms. User layouts at 100 MHz
should have impedance from VDD_ARM_CAP to ground of 0.065 ohms or less.
Hello,
Please create request for further discussion.
https://community.nxp.com/docs/DOC-329745
Have a great day,
Yuri
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Hi Tomohisa,
If you are willing to go for ready-to-deploy iMX6QPOP based SoM modules for your end design , please have a look at https://www.mistralsolutions.com/product-engineering-services/products/vise-board/
Thanks,
Vijai