Hello,
The app note "MMA845xQ Design Checklist and
Board Mounting Guidelines"
Document Number: AN4077
Rev. 2, 10/2012
Page 7, Item 7 says " Do not place any components or vias at a distance less than 5 mm from the package land area. This may cause additional package stress if it is too close to the package land area."
Why? Especially when demo board on Page 5 shows vias and parts right up next the the device.
Also, the recommend land sizes are different in the newer datasheet compared to the app note.
Document Number: MMA8451Q Rev. 10.3, 02/2017
