Hi.
1. ) we have such diagram hosted in NXP tool for design which is Enterprise Architect. If you are an NXP user, text me over Teams and I can share a snapshot of it.
2.)
A the moment the bootloader delivered via Platform Software Integration has a static approach, meaning that you boot only once (based on a static configuration) and then after cores start, bootloader context is loss.
We are in progress of making the boot process more flexible by using a boot service, which can be invoked at runtime (i.e. upon an OTA) and can be dynamically programmed, including where to boot from, and what cores to boot or reboot. This is WIP for G2/G3 device (in GoldVIP) and Z2/E2 device (GreenVIP). I estimate it available in a release in April/May timeframe.
3.) See explanation from point 2.) Bootloader can be reconfigured, but rebooting with the new configuration requires a cold boot. Bootloader for G2/G3 device is currently being distributed in GoldVIP, no longer in Platform Software Integration
4.) The bootloader package from S32G3 “Integration Reference Examples" is not longer maintained in the “Integration Reference Examples" deliverable, instead it's being distributed as part of the GoldVIP deliverable (nxp.com/goldvip).
We currently support boot from QSPI only because this is the only way to enable secure boot, where secure memory regions (aka SMR) must be installed in flash. There is no way to install SMRs in other boot sources such as SD/eMMC cards.
Technically the bootloader can be easily extended to boot from other sources. Its code is open to customizations.