Hello to the entire community. First of all, I apologize for my English; some of it is mine and some is from Google.
I'm working on a low-level development. I'm appealing to those who have been programming in assembler for a long time, although a good explanation from anyone who understands it will be helpful.
My program is small, only about 8KB of program and 7KB of RAM, but it required the resources, power, and speed of this dual-core. I have some parameters that can be changed by configuration and must be used in EEE.
For this reason, I need to understand a few things:
I've searched the forum and haven't found anything that clarifies the situation.
Where is the buffer RAM defined? Does it use non-paged memory by default, or can I choose it?
Similar question with the EEPROM (D-Flash). Can I choose which D-Flash page to use for EEE or does it use non-paged?
When partitioning, I can't tell it the global address it should use.
I've read the application notes AN3490, AN3743, and Chapter 27 of M9S12XEP100RMV1 where it talks about the 512 Kbyte flash module (S12XFTM512K3V1), since I'm using an XEQ512. I also downloaded the AN3743SW software and don't fully understand it. I mean, I understand it when I read it, but my question is the one I already mentioned.
I would appreciate any help.