P2020 Processor TEPBGA2 Package Construction

[ethan135]

Xilinx's App note XAPP426 indicates they intentionally design in vents between the package's heatspreader (lid) and the organic substrate. Does the P2020 Processor also have these vents designed into its TEPBGA2 package, or is the lid hermetically sealed with the substrate?

[andrei_skok · Accepted solution]

P2020 has small vent holes between the lid and the organic substrate to allow for outgassing and moisture evaporation.

Have a great day,
Andrei

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