PCB Layout for MW7IC915N

[chris_zhang]

Hi,

The reference design of MW7IC915N is 2-layer PCB, and we want to change the PCB to 6-layer, but we has no idea if this solution is available? if yes, please advise if there are any design issue to improve? thanks.

[chris_zhang]

Hi Bro,

Got it, thanks for your support.

[LPP]

You are free to use more signal layers as needed beneath top signal and ground layers. You can reproduce NXP reference design by using the same top layer layout, same top substrate material+thickness and top inner plane as RF ground.

Please, take care about thermal design of the PCB. Thicker board will have higher thermal resistance between device and the heat sink.

Have a great day,
Pavel
TIC
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