This session will present the structure of NXP Yocto layers and mechanism of software delivery. Various architectures (ARM®v7, ARM®v8 and PPC) can be supported, the common software components can be shared by different products (i.MX and QorIQ processors) via the unified NXP Yocto layer which manages the free software and maintained by Yocto community. The commercial software can be delivered via separated layers, QorIQ LS2 SDK is using the mechanism for commercial software delivery, e.g. nsp, openflow, ssp and tcpoffload. The session also introduces how to create Yocto layer for customization changes and commercial products. Watch Video Presentation

This presentation will cover the Hardware Security Module (HSM) and how to use the software kits NXP offers, the HSM Security Firmware and HSM Software Development Kit. We will also cover other security features of the device offered by modules like PASS or TDM and their configuration. Watch Video Presentation

This will be a hands-on session covering the Kinetis Software Development Kit (SDK) and Kinetis Expert using the Kinetis Design Studio Integrated Development Environment (IDE).  

Explore the NXP wearable and fitness product roadmap and solutions platform. Watch Video Presentation

Detailed training session on developing with the LPCXpresso Ecosystem, showing the main features of the tools, from project import/creation, multi-core debug and power optimization. The LPCXpresso boards and IDE toolchain will be used with the latest version of LPCOpen peripheral driver examples. We will cover some cool new features including trace and power analysis.

The two big topics in automotive electronics development in the last five years has been functional safety and security. Sometimes these terms are used synonymously, sometimes completely separately. This thought provoking presentation will explore where the two topics overlap, where they result in contradictory requirements, and indeed whether they are complementary. Watch Video Presentation

Automotive applications based on modern processor technology require more complex hardware design than traditional microcontroller solutions: volatile and non-volatile memories are provided external to the device and multiple power supplies are required. This session provides a guide to developing a hardware platform using the S32V234 processor as an example. Topics covered include: power supply design considerations, memory layout and technology, camera and display connectivity, fast interface technology and serial bus physical interfaces. Watch Video Presentation

There are many variables to consider when implementing and integrating solid state RF power into a cooking appliance. Cavity size and shape, RF feed type, power, thermals, and configuration all factor into design consideration. This session will cover key consideration and methods of simulating to achieve better system design. Watch Video Presentation

Learn about the exciting new Network Function Virtualization use case driving enterprise OEMs and service provider Cloud and premises architectures. Understand the new NXP open standard and optimized NFV system solutions which offers best performance-per-watt. And realize how this NFV software suite, combined with NXP processors, will protect customer CAPEX/OPEX, speed deployment time to market and enable new customer revenue streams.

For the Internet of Things (IoT) in the home to become a reality, companies need an open ecosystem approach that addresses all aspects from the IPv6 based mesh networking protocol to the end user experience. This class will explain how Thread fits into the smart home landscape, the key benefits Thread provides and how to take your Thread product concept from an idea to a product in the market using building blocks provided by NXP and other resources in the Thread ecosystem. Watch Video Presentation

The hottest topic in automotive design today is the concept of the eCockpit -- where all visual functions in the car are controlled across multiple screens and fully integrated for the driver’s convenience. The key technology that enables eCockpit to run on a single processor also offers new capabilities in industrial, embedded and consumer products such as drones, manufacturing HMI interfaces and smart displays. This class will cover the fundamental technologies and architectural techniques in the i.MX 8 processor which enables rich eCockpit functionality, how NXP has implemented the world’s most significant full chip virtualization capabilities in an ARM-based processor and breaks down the eCockpit demo from the Tech Lab.  Watch Video Presentation

Today’s designers are facing ever increasing challenges to protect their intellectual property and products from counterfeiting or unauthorized access. To help customers better understand the solutions offered by NXP, Future’s System Design Center has designed a Secure Access Demo board to showcase the capabilities of the LPC43S57, a microcontroller with integrated security, and the A700X, a tamper resistant secure MCU solution. This class will present an overview of the architecture of a secured system and provide an introduction to the secured elements from NXP. Watch Video Presentation

As the 5G standard is being defined, high throughput, low latency and a high number of users are among the key requirements to drive 5G services. See how NXP is blending these ingredients to design an optimal hardware architecture to address the challenges of 5G.

We will provide an overview of the device feature set and capabilities including: Detailed block diagram, image processing block descriptions, vision pipeline, power supply and external hardware requirements. Also we will review the available hardware and software tools, Lauterbach debugger use, key points, tips and tricks to ease the development process.

About a decade ago, NXP introduced its first generation Near Field Magnetic Induction (NFMI) radio, to help connecting hearing impaired persons with the digital world. Today, besides medical applications, NFMI is also being used in consumer devices to reduce power consumption and not be affected by body tissue absorption. NXP NFMI allows for hearable and wearable devices that can fit inside an ear canal or be worn on the body. Power levels are low enough to run for a week on a single ZnAir battery. Applications include truly wireless earbuds, implantable electronics, body area networks, under water communication devices, and many other low power.

Trusted Platform Modules (TPMs) are standards based hardware roots of trust with protected key storage. This session covers how QorIQ Trust Architecture primitives can be used as Soft TPM, thereby reducing BOM cost by eliminating a discrete TPM chip.

The NXP supply chain team will present an overview of the new NXP global manufacturing footprint, as well as integrated strategies for supply assurance and crisis management. An overview of current supply chain systems integration activities will be discussed as well as customer order management strategies moving forward. A special focus will be placed on highlighting changes that will affect NXP customers. Watch Video Presentation

Building on top of 11 years of usage within data centers, Xen Hypervisor is uniquely placed to support a new range of use cases for embedded solutions. In particular, its isolation and security features, flexible virtualization modes and architecture, driver disaggregation, and strong ARM support make it a perfect fit for embedded applications. Artem Mygaiev, GlobalLogic’s Embedded Practice Head, will explore the virtualization nuances and challenges of using Xen Hypervisor for embedded applications through the demonstration of his own company’s journey in developing a platform that leverages Xen for virtual network equipment, IoT, automotive, and other embedded use cases.

Networking devices use high-speed differential signaling that can exceed 10 Gbps. Circuit design for the transmitter (TX) and receiver (RX) elements in the high speed channel have capabilities of offset signal losses in the PCB and system. This session will review the high-speed signal channel and its characteristics and illustrate how the TX and RX circuits in general are used to offset signal losses. It will also show key characteristics of the channels that are needed to allow these TX and RX circuits to work effectively. This session will also address maximum length of the PCB channel, PCB-specific structures that need to be optimized and the usage of the IBIS-AMI models for 5-10 Gbps operation. Examples of channels from PCB designs at NXP will also be included. Watch Video Presentation