We are implementing an MK24FN1M0VDC12 controller based design and wanted to confirm the correct package marking for this device including part number, die version, date code and fab facility. Although we can find the related XFBGA121 footprint information, we are unable to find a package marking specification on the NXP site for this device.
已解决! 转到解答。
Hi @Dickinson ,
Please don't ask this question here. You can create a ticket in here. https://support.nxp.com/s/
Regards,
Jing
Hi @Dickinson ,
Please don't ask this question here. You can create a ticket in here. https://support.nxp.com/s/
Regards,
Jing