Exposed die attach pad

[vicentegomez]

This is a discussion in behalf of arthurhsu

Hi there,

Does MKL14Z64VFT4's "Exposed die attach pad" have to

connect to GND? Is it note on datasheet? Thank you

[vicentegomez · Accepted solution]

Hi Arthur

The majority of QFN packages are base on thermally/electrically enhanced lead-frame technology; the

bottom of the package provides the primary heat removal path, as well as excellent electrical grounding to

the PCB through an exposed pad (EP).

this and other recommendation for the QFN packages you can found it on the application note AN4530

http://www.freescale.com/files/sensors/doc/app_note/AN4530.pdf

have a good day