Chip scale package with no bumps

[davidmichaeli]

hello, is it possible to order a WLCSP packaged ic (for example the MK22FN512CBP12R) Without the solder bumps. I'm aware recalling and de balling is a possibility for larger pitched components but here the pitch is too small to handle.

Thanks, david

[vicentegomez]

Please check the package your way for Kinetis MCUs​

Regards

Vicente Gomez