PCA85133U/2DA/Q1Z

[ppnachi]

Hi,

My Segment LCDs are in production from China. To choose a driver IC for the LCDs, I found a NXP part number PCA85133U/2DA/Q1Z.  

This is a bare die chip. According to the datasheet it says this chip is compatible for COG fabrication. But for my application, I'm looking for a COB bare die chip. 

My question is does the above mentioned part number will support for the COB fabrication? If yes I want to buy bulk quantity. 

Waiting for your reply and advise 

Rgds 

Nazar PP 

[TomasVaverka · Accepted solution]

Hi,

The PCA85133U/2DA/Q1Z is a bare die chip optimized for anisotropic conductive film (ACF) bonding. 

As the COB fabrication typically requires a packaged IC or a bare die with suitable wire bonding and encapsulation support for mounting on a PCB, the PCA85133U/2DA/Q1Z is not suitable for that.

BRs, Tomas