This presentation will highlight the key lessons learned of these deployments and how today's designs need to be architectured to be prepared to this massive innovation wave seen in the metering space including wide variety of markets requirements, wide variety of networks topologies, wide variety of communications protocols and silicon innovation acceleration. The presentation will also review how Freescale has developed a complete strategy around its Kinetis product line that will enable customers to quickly start their designs with low risk, high flexibility and security while being at the optimum price point. 

Learn how to setup, configure, build and install images for a Yocto Project™ based i.MX BSPs and QorIQ SDK boards. Learn about the Yocto Project environment and how Freescale releases i.MX and QorIQ Linux distributions. Details will be shared about bitbake, build environment, customization and board bringup. For QorIQ, additional topics will cover the emulation, ADT and pre-bootloader code. Learn about new layer meta-Freescale that supports combined i.MX and QorIQ product lines with common build environment.

This session will give you an understanding of how power is dissipated in a motor driver. You will also get a hands-on demonstration showing the waveforms of the MC33926 and MC33HB2001 as they are driven into current limit.

Accelerometers, Magnetometers, Gyroscopes, Pressure Sensors. Gathering sensor data at 400 samples per second, on 9 axes, results in 700 MB of data per day. This hands-on class will show what information is contained in sensor data and how to reduce the amount of recorded data dramatically without any major loss of targeted information. They will then compare data between dumb and intelligent data loggers, and understand the techniques used to compress the information.

The standard CAN protocol has been extended into CAN Flexible Data (FD) to provide higher bandwidth while keeping the physical characteristics that have made it the most popular automotive in-vehicle communications protocol . This presentation will provide an overview of the changes to the standard as well as address the challenges faced while rolling out and implementing the technology.

Dr. Todd Hubing of Clemson University shares his vast expertise regarding the impact of transmission line design on EMC performance of electronic control systems. In automotive systems, the wiring harnesses play a key role in coupling electronic noise to and from the components. Shielding and filtering the wiring harness and connector generally are not viable options, so it is important to address cable coupling issues with proper board-level design practices. This session will cover various cable-coupling mechanisms and grounding strategies. It also will include the options available at the board level for ensuring automotive components don't put excessive noise on the harness and that noise on the harness doesn't affect the proper operation of the component circuitry.

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

The need is increasing to program a second application code image in flash while still executing the microcontroller's application and then switching to the new code image. Example implementations for Freescale microcontroller architectures are presented to demonstrate how to do concurrent programming with application execution and subsequent remap to the new application code image.

The Kinetis software development kit (SDK) provides a comprehensive software framework for Kinetis MCU-based applications. Join this session to get hands-on experience with the basics of Kinetis SDK, including MCU boot-up, board setup, interrupt handling, HAL and drivers.

This session will provide an introduction to designing audio and non-audio accessories for smartphones and tablets based on Kinetis MCUs and i.MX applications processors. Several demos will be included.

The material presented will focus on the basic principles and physics of electromagnetic energy.  It will be presented in easy to understand language with plenty of diagrams. Attendees will discover how understanding the behavior of EM fields can help to design PCBs that will be more robust and have better electromagnetic compatibality performance. This is not rocket science, but an easy to understand application of PCB geometry.

In this workshop, we will dive deep into the advanced usage of the Kinetis Design Studio IDE, including how to use it with a version control system, automating builds and debug sessions. Also, learn how to generate coverage and profile your application.

The ARM® 64-bit architecture is rapidly emerging as a standard ISA spanning all segments of the networking space, bringing the industry closer to having a single standard platform for networking and network function virtualization (NFV). The Linaro engineering organization is dedicated to the consolidation of open source software and tools for the ARM ISA, focused on building a robust ecosystem around a single runtime software platform. The primary activities of the networking working group of Linaro will be examined, including the role, objectives and activities of Open Dataplane -- an effort to create a platform independent and vendor-neutral standard API for optimized packet processing for NFV and traditional networking services, and its relationship to activities such as the Open Platform for NFV (OPNFV) initiative.

This session covers thermal mechanical design options for routing and dissipating heat within an enclosure that utilizes the i.MX 6Quad processor. Additionally, the course will cover passive thermal options such as graphite paper, thermal pads, the pros/cons of metal heat spreaders like copper and suggestions for implementation based on which i.MX 6 series processor is being utilized. Presented by Asim Zaidi Presented at DwF Silicon Valley - March 26, 2015 Session ID: AMF-DES-T1059

The Kinetis family of MCUs is in constant growth and has become the most scalable and wide MCU family in the market based on ARM® Cortex™-M processors. KinetisK series, ARM Cortex-M4 based, is adding new cost-effective devices and memory densities. The Kinetis L family, based on the ARM Cortex M0+ core, grows with more ultra-low power devices. The Kinetis W series offers wireless functionality by integrating class-leading sub-1 GHz and 2.4 GHz RF transceivers. For high accuracy electricity metering and test and measurement applications Kinetis M introduces 24-bit sigma delta ADC and low noise amplifiers on-chip. Kinetis V family offers new Motor Control possibilities starting with low cost ARM Cortex M0+ based devices. But there is more to come! This session offers an overview of the current status of Kinetis families and roadmaps.

The D-Bug12XZ firmware combined with the Freescale LFBDMPGMR BDM programmer hardware provides a powerful low-level debugging environment for S12 and S12X MagniV devices. There are times when Electronic Control Modules (ECM) in a car will become inoperative or unresponsive to normal communication channels such as CAN or LIN. The Background Debug Module (BDM) on these devices combined with the D-Bug12XZ  debugger provides the ability to reliably ‘hot-connect’ to the S12 and S12X MagniV devices without resetting or disturbing the running target. Once BDM communications is established with the target, the MCU’s I/O and memory resources can be uploaded for analysis. This session will teach the features and use of these tools to ‘hot connect’ to an unresponsive target MCU with the goal of determining the possible cause of the software and/or hardware failure.

This session will cover how to differentiate and to attach Freescale Power Management solutions to most Freescale MCU and MPUs for complete system enablement in IoT, automotive and multi-market applications. Thanks to a complete MCU tool alignment strategy for industrial applications in Transportation, Energy Management and Building Control segments, we can provide the fastest time to market for your customers. The presentation will include live demonstrations  with analog software drivers that are MCU agnostic, in order to better position Freescale Analog System solutions during your next customer visit.

How to develop a proper GUI with FreeMASTER and integrate it to a MCU for development and debugging purposes.

Freescale Connected Intelligence helps to bring the full potential of the IoT to life, delivering intelligence everywhere so designs and whole systems can scale and interact seamlessly and securely. This session will present the Freescale solutions addressing the challenges of IoT, with a focus on Wireless Connectivity platforms. Presented by Cyril Zarader Presented at DwF Tel Aviv - January 27, 2015 Session ID: EUF-IND-T0970