This session covers thermal mechanical design options for routing and dissipating heat within an enclosure that utilizes the i.MX 6Quad processor. Additionally, the course will cover passive thermal options such as graphite paper, thermal pads, the pros/cons of metal heat spreaders like copper and suggestions for implementation based on which i.MX 6 series processor is being utilized.
Presented by Asim Zaidi
Presented at DwF Silicon Valley - March 26, 2015
Session ID: AMF-DES-T1059
