As technology becomes more closely integrated into all aspects of human life, the microcontroller is essential to delivering the human-to-machine interface, or HMI. Kinetis MCUs based on ARM® Cortex®-M cores integrate a number of HMI capabilities. This session will detail the input and output capabilities of Kinetis MCUs spanning from simple push buttons to advanced displays. You will receive an overview of how to meet the HMI requirements for your next embedded design.

The much-anticipated i.MX 7 series is designed for IoT applications, point-of-sale products and a host of other cost-sensitive embedded applications. This class will reveal additional details of this next-generation i.MX series, focusing on security, processing capabilities and low-power technology.

For the Internet of Things (IoT) in the home to become a reality along with mass adoption, companies need a protocol that improves network architecture and is also low-power, secure and scalable. This class will examine the latest efforts by the Thread Group to achieve network interoperability across devices in the home and the technical roadblocks that have prevented widespread adoption of the connected home to date. The session will further detail why the Thread Group was created, what it covers and how it solves reliability, security, power and compatibility issues in order to help manufacturers and consumers connect products around the home. An overview of Freescale's Thread solution will be presented along with a complete demonstration.

This session will introduce the standard AUTOSAR concepts and the Freescale AUTOSAR production grade software. The hands-on will focus on using the AUTOSAR MCU Abstraction Layer drivers (MCAL), AUTOSAR real-time operating system (OS) and getting started with an automotive application. The session will include a step-by-step approach, guiding the audience through the software configuration, code generation and up to running the application on a Freescale automotive microcontroller.

This presentation will highlight the key lessons learned of these deployments and how today's designs need to be architectured to be prepared to this massive innovation wave seen in the metering space including wide variety of markets requirements, wide variety of networks topologies, wide variety of communications protocols and silicon innovation acceleration. The presentation will also review how Freescale has developed a complete strategy around its Kinetis product line that will enable customers to quickly start their designs with low risk, high flexibility and security while being at the optimum price point. 

Learn how to setup, configure, build and install images for a Yocto Project™ based i.MX BSPs and QorIQ SDK boards. Learn about the Yocto Project environment and how Freescale releases i.MX and QorIQ Linux distributions. Details will be shared about bitbake, build environment, customization and board bringup. For QorIQ, additional topics will cover the emulation, ADT and pre-bootloader code. Learn about new layer meta-Freescale that supports combined i.MX and QorIQ product lines with common build environment.

This session will give you an understanding of how power is dissipated in a motor driver. You will also get a hands-on demonstration showing the waveforms of the MC33926 and MC33HB2001 as they are driven into current limit.

Accelerometers, Magnetometers, Gyroscopes, Pressure Sensors. Gathering sensor data at 400 samples per second, on 9 axes, results in 700 MB of data per day. This hands-on class will show what information is contained in sensor data and how to reduce the amount of recorded data dramatically without any major loss of targeted information. They will then compare data between dumb and intelligent data loggers, and understand the techniques used to compress the information.

The standard CAN protocol has been extended into CAN Flexible Data (FD) to provide higher bandwidth while keeping the physical characteristics that have made it the most popular automotive in-vehicle communications protocol . This presentation will provide an overview of the changes to the standard as well as address the challenges faced while rolling out and implementing the technology.

Dr. Todd Hubing of Clemson University shares his vast expertise regarding the impact of transmission line design on EMC performance of electronic control systems. In automotive systems, the wiring harnesses play a key role in coupling electronic noise to and from the components. Shielding and filtering the wiring harness and connector generally are not viable options, so it is important to address cable coupling issues with proper board-level design practices. This session will cover various cable-coupling mechanisms and grounding strategies. It also will include the options available at the board level for ensuring automotive components don't put excessive noise on the harness and that noise on the harness doesn't affect the proper operation of the component circuitry.

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.

The need is increasing to program a second application code image in flash while still executing the microcontroller's application and then switching to the new code image. Example implementations for Freescale microcontroller architectures are presented to demonstrate how to do concurrent programming with application execution and subsequent remap to the new application code image.

The Kinetis software development kit (SDK) provides a comprehensive software framework for Kinetis MCU-based applications. Join this session to get hands-on experience with the basics of Kinetis SDK, including MCU boot-up, board setup, interrupt handling, HAL and drivers.

This session will provide an introduction to designing audio and non-audio accessories for smartphones and tablets based on Kinetis MCUs and i.MX applications processors. Several demos will be included.

The material presented will focus on the basic principles and physics of electromagnetic energy.  It will be presented in easy to understand language with plenty of diagrams. Attendees will discover how understanding the behavior of EM fields can help to design PCBs that will be more robust and have better electromagnetic compatibality performance. This is not rocket science, but an easy to understand application of PCB geometry.

In this workshop, we will dive deep into the advanced usage of the Kinetis Design Studio IDE, including how to use it with a version control system, automating builds and debug sessions. Also, learn how to generate coverage and profile your application.

The ARM® 64-bit architecture is rapidly emerging as a standard ISA spanning all segments of the networking space, bringing the industry closer to having a single standard platform for networking and network function virtualization (NFV). The Linaro engineering organization is dedicated to the consolidation of open source software and tools for the ARM ISA, focused on building a robust ecosystem around a single runtime software platform. The primary activities of the networking working group of Linaro will be examined, including the role, objectives and activities of Open Dataplane -- an effort to create a platform independent and vendor-neutral standard API for optimized packet processing for NFV and traditional networking services, and its relationship to activities such as the Open Platform for NFV (OPNFV) initiative.

This session covers thermal mechanical design options for routing and dissipating heat within an enclosure that utilizes the i.MX 6Quad processor. Additionally, the course will cover passive thermal options such as graphite paper, thermal pads, the pros/cons of metal heat spreaders like copper and suggestions for implementation based on which i.MX 6 series processor is being utilized. Presented by Asim Zaidi Presented at DwF Silicon Valley - March 26, 2015 Session ID: AMF-DES-T1059

The Kinetis family of MCUs is in constant growth and has become the most scalable and wide MCU family in the market based on ARM® Cortex™-M processors. KinetisK series, ARM Cortex-M4 based, is adding new cost-effective devices and memory densities. The Kinetis L family, based on the ARM Cortex M0+ core, grows with more ultra-low power devices. The Kinetis W series offers wireless functionality by integrating class-leading sub-1 GHz and 2.4 GHz RF transceivers. For high accuracy electricity metering and test and measurement applications Kinetis M introduces 24-bit sigma delta ADC and low noise amplifiers on-chip. Kinetis V family offers new Motor Control possibilities starting with low cost ARM Cortex M0+ based devices. But there is more to come! This session offers an overview of the current status of Kinetis families and roadmaps.