P1011NXN2DFB Specification Question

[dannydeng]

Can anybody provide the  Max stress  of the IC that could withstand and the Max weight the IC could withstand ?

Thanks.

[LPP]

Please, refer to AN4259 Section 27.2 Thermal Management for WB-TePBGA

"The heat sink should be attached to the printed-circuit board with the spring force centered over the center of the package. This spring force should not exceed 10 pounds of force (45 Newton)."

http://www.nxp.com/products/microcontrollers-and-processors/power-architecture-processors/qoriq-powe...