从i.MX RT1170A 到 i.MX RT1170B​迁移文档

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从i.MX RT1170A 到 i.MX RT1170B​迁移文档

从i.MX RT1170A 到 i.MX RT1170B​迁移文档

​迁移重点​​:
  • ​检查GPIO配置​​:利用新时序建议优化设计。
  • ​更新SDK至25.06+​​:确保芯片版本识别和ROM API兼容。
  • ​验证SEMC设计​​:若使用CSX1/2/3,需按ERR052401调整时序。
  • ​工具链升级​​:J-Link v8.38+和MCUXpresso脚本更新。

 

0. 本文目的

 

  •  若您并未遇到RT1170 FSGPIO漂移老化问题,请忽略本文档。
  • 若您遇到RT1170A的ERR052351(输出电压>1.98V时参数漂移)和ERR050643(上电瞬间误触发上拉脉冲)问题,并想通过迁移到新硅片RT1170B,请查看本文完成迁移。

1. 硅片变更 (Silicon Changes)​

  • ​GPIO修复​​:
    • 解决了RT1170A的ERR052351(输出电压>1.98V时参数漂移)和ERR050643(上电瞬间误触发上拉脉冲)问题。
    • 影响范围:GPIO_AD/GPIO_LPSR/GPIO_DISP_B2 bank。
  • ​ROM更新​​:
    • 清理ROM补丁(不影响开放API)。
    • ​HAB API向量表地址​​:从0x0021_1C0C(A版)改为0x0021_1C14(B版)。
    • ROM_FLEXSPI_NorFlash_ClearCache()入口地址变更(详见第6节)。
  • ​芯片ID变更​​:
    • MISC_DIFPROG寄存器的CHIPID复位值变化:
      • A版:0x001170A0
      • B版:0x001170B0(需通过bit[7:4]区分:A版=1011,B版=1100)。

​2. 数据手册变更 (Data Sheet Changes)​

  • ​型号命名​​:所有型号后缀从A改为B(例:MIMXRT117xxxxxB)。
  • ​GPIO电气规范​​:
    • ​表37​​:GPIO_AD/LPSR/DISP_B2的驱动电流调整(如DSE=1时IOH从-10mA→-9mA)。
    • ​表40​​:
      • 新增Vpead参数。
      • 上升/下降时间调整(如DSE=0/SRE=1时从6ns→7.5ns)。
      • ​关键建议​​:
        • 3.3V模式:≥25MHz用连续范围模式(Continuous Range),<25MHz用高范围模式(High Range)。
        • 1.8V模式:推荐低范围模式(Low Range)。
  • ​其他更新​​:
    • 存储温度范围:-40℃ → ​​-55℃​​。
    • SDR50/SDR104时序:输入建立时间从2.5ns→2.0ns。
    • FlexSPI时序:TDVO最大值从4→1,TDHO最小值从2→0。

​3. 参考手册变更 (Reference Manual Changes)​

  • ​芯片ID识别​​:
    • MISC_DIFPROG[7:4]复位值从固定值改为​​芯片版本标识​​(A版=1011,B版=1100)。

​4. 勘误变更 (Errata Changes)​

 

  • ​修复问题​​:
    • 移除ERR052351(GPIO参数漂移)和ERR050643(上电脉冲问题)。
  • ​新增问题​​:
    • ​ERR052401​​:SEMC_CSX1/2/3信号时序退化(SYNC模式最大延迟增加2.4ns)。
    • ​规避方案​​:
      • SYNC模式:优先使用SEMC_CSX0或SEMC_RDY作为片选。
      • Async模式:调整SEMC配置寄存器(SRAMCR1/NORCR1的CES位)。

​5. SDK代码变更 (SDK Code Changes)​

/*!
 * @brief ROM API init.
 */
void ROM_API_Init(void)
{
    if (ANADIG_MISC->MISC_DIFPROG == 0x001170a0U) // A版
    {
        g_bootloaderTree = ((bootloader_api_entry_t *)*(uint32_t *)0x0020001cU);
    }
    else // B版
    {
        g_bootloaderTree = ((bootloader_api_entry_t *)*(uint32_t *)0x0021001cU);
    }
}
  • FlexSPI缓存清除函数入口地址变更:ROM_FLEXSPI_NorFlash_ClearCache
/*! @brief Software reset for the FLEXSPI logic. */
void ROM_FLEXSPI_NorFlash_ClearCache(uint32_t instance)
{
    uint32_t clearCacheFunctionAddress;
    if (ANADIG_MISC->MISC_DIFPROG == 0x001170a0U)
    {
        clearCacheFunctionAddress = 0x0020426bU;
    }
    else if (ANADIG_MISC->MISC_DIFPROG == 0x001170b0U)
    {
        clearCacheFunctionAddress = 0x0021a3b7U;
    }
    else
    {
        clearCacheFunctionAddress = 0x0021a3bfU;
    }
  • HAB API vector table addresses变更:从0x0021_1C0C(i.MX RT1170A) to 0x0021_1C14(i.MX RT1170B). SDK无影响,SBL github已经解决。

​6. 工具变更 (Tool Changes)​

  • ​J-Link​​:需升级至​​v8.38或更高版本​​。
  • ​MCUXpresso​​:v24.12及更早版本需更新RT1170_reset.scp脚本中的芯片ID检测逻辑。

​7. 通用数据手册更新 (Appendix A)​

  • ​电压范围​​:
    • NVCC_GPIO重命名为​​NVCC_AD​​(后续版本将恢复原名)。
    • NVCC_AD/DISP2/LPSR最大值从1.95V→​​1.98V​​。
  • ​GPIO模式定义​​:
    • 统一命名:​​连续范围模式​​(原Normal/Derated)、​​低范围模式​​(原Low)、​​高范围模式​​(原High)。
  • ​时序优化​​:
    • LPSPI主模式频率上限从30MHz→​​60MHz​​,建立时间从10ns→3ns。
  • ​新增警告​​:
    • GPIO_AD/LPSR/DISP_B2的NVCC不可悬空,否则可能漏电​​500μA/每Bank​​。

​8. 其他信息​

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‎09-08-2025 02:48 AM
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