iMX6 PCB manufacturing method

[Kazuma_Sasaki]

I would like to confirm manufacturing method of SABRE-AI and SDB boards.

I guess these boards made by build-up method. Is it right?

Best Regards,

Kazuma Sasaki.

[Kazuma_Sasaki]

Hello gusarambula,

Thank you for your answer. I understood clearly.

Best Regards,

Kazuma Sasaki.

[gusarambula]

Hello Kazuma Sasaki,

I think the SBD boards are through-hole and not build-up, but let me confirm for the SDB and also SABRE-AI and I’ll let you know.

Regards,

[Kazuma_Sasaki]

Hello gusarambula,

I appreciate your support. I've checked both gerber data.

I believe both boards are build by through-hole method. because, all vias located on same position at all layer.

But, I could not find any comments into any documents.

Best Regards,

Kazuma Sasaki.

[gusarambula · Accepted solution]

Hello Kazuma Sasaki,

While it’s not mentioned on the documentation both the SABRE-SDB and the SABRE-AI boards don’t use build-up vias as they make the manufacture more costly and not all manufacturers can do build-up vidas. They both use through-hole.

I hope this information helps,

Regards,