Hi,
We have set up our Yocto build process to produce a signed U-Boot and a signed Linux kernel. We've done this by preparing the CSF (Command Sequence File) and passing it along with the images to the CST (Code Signing Tool).
We now want to create an encrypted U-Boot image and an encrypted Linux kernel image. We've read:
So my understanding is we need to do the following:
My question is about how this could/should be implemented as a mass production process. Normally during our production manufacturing steps, we would flash a prepared image and then test that the target hardware is functional (among other steps). To achieve an encrypted U-Boot and Linux kernel it would appear that we are going to have a much more sophisticated process where images/files are copied to and from the target and the target needs to be flashed more than once. This is going to make our production manufacturing process more complicated and take longer.
My questions are:
Hi @Nocker
The process seems no problem, just be sure that the blob can be generated based on the closed device.
The step 7, Please pay more attention to the process of copying both blobs.
2. Is my understanding correct that step 6 must be done on each target because each target will create a unique DEK blob?
That is correct, if the device closed.
To other questions, I'm getting confirmation, please bear with some time.
Best regards
Harvey
Is anyone from NXP able to advise if I'm on the right track? Thanks.