Question about SDP schematic

[ko-hey]

Hi all

I want to make custom board and divert a SDP's schematic as much as possible.

Also I want to minimize the number of components.

So if there are unnecessary components, I will remove it.

Please let me know the following questions.

1. Which bulk capacitor is better to connect VDDHIGH_CAP and NVCC_PLL_OUT ?

Following recommendation is in design checklist.

Only one 10 μF bulk capacitor should be connected to each of these on-chip LDO regulator outputs: VDDHIGH_CAP/NVCC_PLL_OUT/VDDUSB_CAP.Decoupling capacitors such as 0.1 μF or 0.22 μF should also be used.

But VDDHIGH_CAP/NVCC_PLL_OUT is connected to 22μF bulk capacitor in SPF-27417_C4.pdf.

Which is better, 10μF or 22μF ?

Also please tell the reason why SDP use 22μF.

2. Can we remove diode D10 ?

Following note is in schematic.

NOTE:

Diode D10 is required to correct a problem on a small number of i.MX6 DualLite parts in which VDDSNVS does

not come up when VDDHIGH_IN is applied. A similar problem was corrected on i.MX6Q TO1.2 processors. The

diode is left populated for similarity across the Smart Device family of boards.

In my understanding, diode D10 need only for when using silicon revision 1.2.

So we can remove the diode D10 when we use rev 1.3. Is my understanding correct ?

3. What is the funciton of C504 capacitor ?

In P21 of SPF-27417_C4.pdf, WDOG_B is connected to 2.2μF capacitor.

What the purpose of it ?

4. Must user use 6.04kOhm 1% resistor for DSI_REXT and CSI_REXT ?

In Table 2-13 of hardware design guide, NXP recommend to connect to 6.04kOhm 1% resistor for DSI_REXT and CSI_REXT.

Must user use 6.04kOhm 1% resistor for DSI_REXT and CSI_REXT ?

Can I use other value and accuracy resisitor such as 10KOhm 5% ?

I want to use same components as much as possible.

Add info: I plan to use CSI and DSI.

5. Why do you use 2.3KOhm for I2C ?

Why did you choise 2.3KOhm for I2C ?

The resistor value is depends on user's board sinal integrity.

Is my understanding correct ?

Ko-hey

[Yuri · Accepted solution]

Hello,

Please look at my comments below.

1.
  Please follow recent Design Checklist recommendations.

The board was designed earlier.

2.

  From the Design checklist : "If VDD_SNVS_IN is directly supplied by a coin cell, a

schottky diode is required between VDD_HIGH_IN and VDD_SNVS_IN. The cathode
is connected to VDD_SNVS_IN. Alternately, VDD_HIGH_IN and VDD_SNVS_IN can be

tied together if the real-time clock function is not needed during system power-down."

3.
The scheme may be considered as CR differentiator, which forms PWRON pulse .

4.
One must use 6.04kOhm 1% resistor for DSI_REXT and CSI_REXT.

5.

  Please use section "Maximum and minimum values of resistors Rp and Rs" of the I2C specs.

Have a great day,
Yuri

-----------------------------------------------------------------------------------------------------------------------
Note: If this post answers your question, please click the Correct Answer button. Thank you!
-----------------------------------------------------------------------------------------------------------------------

[ko-hey]

Hi Yuri

Thank you for reply.

1.

Okay, thank you.

2.

My custom board don't have coin cell.

In that case, I don't need the schottky diode.

Is my understanding correct ?

3.

Okay, thank you.

4.

I understand that it must use the spec resistor for those pins.

5.

From your answer, the resistor value depends on user's use case.

So user have to calculate from the formula that is shown in section 7.1 of the following document.

http://www.nxp.com/documents/user_manual/UM10204.pdf

Is it correct ?

Ko-hey

[Yuri]

Hello,

2.

yes, there is no the diode, but it is recommended to tie VDD_HIGH_IN and VDD_SNVS_IN together,
if the real-time clock function is not needed during system power-down.

5.

Correct.

Regards,

Yuri.

[ko-hey]

Hi Yuri

Thanks!

Ko-hey