According to the data manual description，if the temperature change of NCK2910 exceeds 20 ° C, it will trigger the PLL UNLOCK problem.
But we found through temperature box testing that the temperature change at which failure occurs at different starting temperatures is not a stable range of 20 ° C, but rather a range.
We would like to know if there is theoretical calculation support for the relationship between triggering VCO recalibration and temperature when the temperature value exceeds 20 ° C? Or test data？Is there any internal testing data available for NXP to refer to? thank you!
The following table is the data we tested using a temperature box, adjusting the rate of temperature rise and fall to detect temperature changes during the F4 event.
At different starting temperatures, the temperature range for triggering the F4 event is inconsistent, ranging from 21 ℃ to 37 ℃.
Failure testing----Temperature rise |
time interval（h） | Start Temperature（℃） | Termination temperature（℃） | Temperature difference（℃） | Temperature change rate（℃/min） |
2.6 | -19 | 5 | 24 | 0.16 |
3.6 | 5 | 40 | 35 | 0.16 |
2.5 | 27 | 48 | 21 | 0.14 |
Failure testing-----Temperature drop |
time interval（h） | Start Temperature（℃） | Termination temperature（℃） | Temperature difference（℃） | Temperature change rate（℃/min） |
5.5 | 69 | 34 | -35 | 0.11 |
3.9 | 52 | 19 | -33 | 0.14 |
4.0 | 49 | 12 | -37 | 0.15 |
3.6 | 12 | -21 | -33 | 0.15 |
