Hello,
Is there any information on physicals and electrical interfaces for the GoldBox-3?
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Hi,
We understand that this information is not provided. We do apologize.
The information that may be available is on regards of temperature, which is the following (only for RDB2):
"RDB2 is designed for room temperature environment.
The board may work abnormally or be damaged in the high/low temperature test."
And about rugged (we think so?):
Still, help us contacting your local NXP representative/FAE/DFAE, since they may more information available than the one we have through this channel. We do apologize.
Please, let us know.
Hi,
We understand that this information is not provided. We do apologize.
The information that may be available is on regards of temperature, which is the following (only for RDB2):
"RDB2 is designed for room temperature environment.
The board may work abnormally or be damaged in the high/low temperature test."
And about rugged (we think so?):
Still, help us contacting your local NXP representative/FAE/DFAE, since they may more information available than the one we have through this channel. We do apologize.
Please, let us know.