Hello,
I would like the manufacturer (NXP) to provide recommended practice for mounting the High Power LDMOS MRFX1K80H devices:
1) Use 'Liquid Metal' thermal grease and two M3 screws, Torque screw to {TBD} torque value.
or
2) Create a well in the copper heat spreader that just fits the LDMOS device, apply a thin layer of solder paste on the bottom of device, then place device in the well, and reflow solder
(what's recommended for reflow profile? i.e. ramp to 240C, then jump to 260C for 15s. then cool)
Which one is best practice for such a high power device? Method #1 or # 2
thanks
Dan
