MRFX1K80H, solder reflow or mechanical mounting

[dan-in-sd]

Hello,

I would like the manufacturer (NXP)  to provide recommended practice for mounting the High Power LDMOS  MRFX1K80H devices:

1)   Use 'Liquid Metal' thermal grease and two M3 screws,   Torque screw to  {TBD}  torque value.

or

2)  Create a well in the copper heat spreader that just fits the LDMOS device,  apply a thin layer of solder paste on the bottom of device,  then place device in the well, and reflow solder 

    (what's recommended for reflow profile?   i.e. ramp to 240C,   then jump to 260C for 15s. then cool)

Which one is best practice for such a high power device?   Method   #1  or   # 2 

thanks

Dan

[Alondra]

Please see our guidelines for solder reflow mounting of high-power RF for MRFX1K80H 

Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages

https://www.nxp.com/docs/en/application-note/AN1908.pdf

Best regards