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how to pick up MPXM2053GS by nozzle

During the SMT process, air may get blown into the pressure port from the pick-and-place nozzle. Is it possible to damage the sensor inside?

Re: how to pick up MPXM2053GS by nozzle

Hello David,

A brief, low-pressure air pulse from the pick-and-place nozzle into the side pressure port is unlikely to cause damage, provided the applied pressure does not exceed the device's maximum rated overpressure. However, repeated or high-pressure air blasts could in principle stress the diaphragm or, under extreme conditions, compromise it.

To avoid any risk entirely, the recommended approach is to position the pick-and-place nozzle on the flat top body surface of the M-PAK package, away from the side pressure port. This ensures the nozzle never contacts or directs airflow into the sensing port opening. Application Note AN1984 – Handling Freescale Pressure Sensors provides specific guidance on nozzle design and placement for this device family and is the primary reference for SMT handling of MPX-series sensors. Application Note AN936 – Mounting Techniques, Lead Forming, and Testing of the MPX Series Pressure Sensors is also a useful complement.

Please note that as of February 2, 2026, NXP MEMS sensor products (including the MPXM2053GS) have been transitioned to STMicroelectronics. For ongoing product support and handling documentation going forward, I recommend also consulting STM directly.

BRs, Tomas