- Forums
- Product Forums
- General Purpose MicrocontrollersGeneral Purpose Microcontrollers
- i.MX Forumsi.MX Forums
- QorIQ Processing PlatformsQorIQ Processing Platforms
- Identification and SecurityIdentification and Security
- Power ManagementPower Management
- Wireless ConnectivityWireless Connectivity
- RFID / NFCRFID / NFC
- Advanced AnalogAdvanced Analog
- Neural Processing UnitsNeural Processing Units
- MCX Microcontrollers
- S32G
- S32K
- S32V
- MPC5xxx
- Other NXP Products
- S12 / MagniV Microcontrollers
- Powertrain and Electrification Analog Drivers
- Sensors
- Vybrid Processors
- Digital Signal Controllers
- 8-bit Microcontrollers
- ColdFire/68K Microcontrollers and Processors
- PowerQUICC Processors
- OSBDM and TBDML
- S32M
- S32Z/E
-
- Solution Forums
- Software Forums
- MCUXpresso Software and ToolsMCUXpresso Software and Tools
- CodeWarriorCodeWarrior
- MQX Software SolutionsMQX Software Solutions
- Model-Based Design Toolbox (MBDT)Model-Based Design Toolbox (MBDT)
- FreeMASTER
- eIQ Machine Learning Software
- Embedded Software and Tools Clinic
- S32 SDK
- S32 Design Studio
- GUI Guider
- Zephyr Project
- Voice Technology
- Application Software Packs
- Secure Provisioning SDK (SPSDK)
- Processor Expert Software
- Generative AI & LLMs
-
- Topics
- Mobile Robotics - Drones and RoversMobile Robotics - Drones and Rovers
- NXP Training ContentNXP Training Content
- University ProgramsUniversity Programs
- Rapid IoT
- NXP Designs
- SafeAssure-Community
- OSS Security & Maintenance
- Using Our Community
-
- Cloud Lab Forums
-
- Knowledge Bases
- ARM Microcontrollers
- i.MX Processors
- Identification and Security
- Model-Based Design Toolbox (MBDT)
- QorIQ Processing Platforms
- S32 Automotive Processing Platform
- Wireless Connectivity
- CodeWarrior
- MCUXpresso Suite of Software and Tools
- MQX Software Solutions
- RFID / NFC
- Advanced Analog
- Neural Processing Units
-
- NXP Tech Blogs
- Home
- :
- Translated Content
- :
- Multi Source Translation Content
- :
- 2403844_en-US
2403844_en-US
- Subscribe to RSS Feed
- Mark as New
- Mark as Read
- Bookmark
- Subscribe
- Printer Friendly Page
- Report Inappropriate Content
2403844_en-US
2403844_en-US
We have assembled MPXM2053GS pressure sensors onto our PCB. During initial testing, a number of units were found to have an output voltage of 0V, which we guess is due to air leakage. After removing the defective devices from the board, we inspected the bottom vent holes and found that they differ visibly from those of the good units. Specifically, the interior of the vent holes on the failed parts appears to contain melted or heat-damaged material. What is the possible root cause of this defect?
Hi David,
The most effective prevention is to define a solder paste exclusion zone on your PCB stencil directly beneath the vent hole location. This ensures no paste is deposited in that area and cannot be drawn into the hole during reflow. Additionally, using a no-clean flux minimizes residue that could otherwise migrate into the opening.
For further support, I would recommend contacting STMicroelectronics directly, as they are the current owner of the MPXM2053 and are best positioned to provide support.
BRs, Tomas
Hi David,
The melted/heat-damaged material inside the vent holes is most likely caused by solder paste or flux intrusion during reflow soldering or by exceeding the maximum permitted peak package body temperature of 250°C (max. 30 seconds). Since the MPXM2053GS is a vented gauge sensor that uses the bottom vent as its atmospheric reference, any blockage of that hole will cause a loss of reference and result in 0V output.
One additional note for your awareness: as of February 2, 2026, NXP MEMS sensor products — including the MPXM2053 series — have been transitioned to STM. For formal failure analysis or ongoing product support, STM is the appropriate contact.
BRs, Tomas