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Does NXP offer a simple TSSOP28 breakout/adapter board for MC33XS2410 prototyping

Hi everyone,

We are currently setting up a prototyping and test bench for a 12V automotive project. Following NXP's recommendation, we selected the MC33XS2410 (eFuse) for our protection circuit.

However, since we are in an assembly workshop and cannot design or manufacture custom PCBs at this stage, handling the HTSSOP28 package (with its 0.65mm pitch and thermal pad) is physically challenging for hand-wiring.

While we are aware of the full-featured FRDM-XS2410EVB evaluation board, it is too complex, too large, and too expensive for our immediate needs on this specific test bench. We only need a minimal way to access the pins.

Before we purchase a generic third-party adapter (like the Aries Electronics LCQT-TSSOP28 breakout board), we wanted to ask the NXP community:

1. Does NXP offer a low-cost, minimal breakout board or prototyping adapter specifically designed to convert the HTSSOP28 package of the MC33XS2410 into standard 2.54mm DIP pins?

2. If not, does NXP officially recommend any specific third-party adapter or socket brand that has been proven to work well with this chip (considering the ground and thermal dissipation requirements of the exposed center pad)?

Thank you very much for your time and help!

Evaluation BoardStarCore DSPsRe: Does NXP offer a simple TSSOP28 breakout/adapter board for MC33XS2410 prototypingThank you Tomas for the clarification and the precautions , i think that's the solution that i will do for my cardsRe: Does NXP offer a simple TSSOP28 breakout/adapter board for MC33XS2410 prototyping

Hello Mohamed,

Currently we do not offer a dedicated low-cost breakout or adapter board that converts the MC33XS2410 HTSSOP28 package directly to a standard 2.54 mm DIP-style footprint. You are right that we offer the FRDM-XS2410EVB, which is intended for full functional evaluation rather than simple package adaptation.

One important consideration is the exposed thermal pad of the MC33XS2410 package which should be soldered to GND for both thermal and electrical performance. We also recommend connecting the exposed pad to a ground plane and, for production designs, using thermal vias to improve heat dissipation.

Please also note that generic breakout boards are generally suitable for functional prototyping and low-power bench testing. However, they typically do not provide the thermal performance achievable with a properly designed PCB, which may limit the maximum continuous current that can be tested. 

If your application requires operation near the device's current limits, I recommend evaluating the thermal performance carefully or using the official evaluation board.

BRs, Tomas