LS1012A packing spec

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LS1012A packing spec

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SHOESLEU
Contributor I

Hi,

How to get LS1012A packing information?

tape reel / tray spec description

the pin 1 orientation in tape reel or tray

 

thanks

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yipingwang
NXP TechSupport
NXP TechSupport

The LS1012A device package type is 9.6 mm x 9.6 mm molded FC-LGA.

The package parameters are as follows: Package 9.6 mm x 9.6 mm molded FC-LGA Pitch 0.5 mm Solder Alloy composition SAC 305 (96.5/3.0/0.5)

Please refer to the application note "Assembly Guidelines for Land Grid Array (LGA) Package": https://www.nxp.com/docs/en/application-note/AN2265.pdf

 

Please refer to the following link:

https://www.nxp.com/products/processors-and-microcontrollers/arm-based-processors-and-mcus/qoriq-lay...

Mounting technique is described in the application note AN5310: https://www.nxp.com/webapp/Download?colCode=AN5310  

LS1012A part marking is provided in the QorIQ LS1012A Data Sheet, 8.2 Part marking.

 

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