Bin file higher than 256KB with LPC1833

[lpcware]

Content originally posted in LPCWare by lalitshah233 on Thu Dec 27 05:55:02 MST 2012
Dear all,

My requirement is for flash image of around 384KB.

I am using LPC1833, which has 512KB memory. Which has been divided into two banks of 256KB.

It is possible to combine image with higher size than 256KB into single image?

How to program this image into the device?

Regards,
Lalit Shah

[lpcware]

Content originally posted in LPCWare by TheFallGuy on Sat Jan 24 02:53:56 MST 2015
Look in the IAR documentation? This is an NXP forum, not an IAR forum.

[lpcware]

Content originally posted in LPCWare by hitpony on Fri Jan 23 21:47:45 MST 2015
I met the same problem for 1857, I have a bin file bigger than 512k, 1857 split into 2 bank, bank A 512k, bank B 512k, and the development tool is IAR 6.6, could you please help to tell the detailed procedure to split into two block and burn to the internal flash?

Thanks in advance!

[lpcware]

Content originally posted in LPCWare by nxp21346 on Fri Jan 11 17:22:11 MST 2013
Hi Lalit,

.BIN files do not contain any address information and have difficulty handling the gap between the two flash memories. It is better to use a .HEX file instead. Most development tools have a language for specifying the chip's memory map to the linker. The linker script can specify the address of the two areas of flash. Most tools generate an .AXF format output which can then be converted directly to a .HEX file and programmed despite having a "hole" in it between the two flash areas.

-Dave @ NXP