MKL24Z32VFM4 exposed pad?

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MKL24Z32VFM4 exposed pad?

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larryklotz
Contributor I

MKL24Z32VFM4 is in an unusual package SOT617-17.  There's not much info on what electrically, if anything, it should attach to.  Package doc calls it "EXPOSED DIE ATTACH PAD".  Should it be attached to VSS/VSSA?

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Robin_Shen
NXP TechSupport
NXP TechSupport

Hi LARRY,

The bottom of the package provides the primary heat removal path, as well as excellent electrical grounding to the PCB through an exposed pad (EP).

Please check the application note AN1902 for more information.

4.2.2Thermal Electrical Pad Guidelines.jpg

Best Regards,

Robin

 

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Robin_Shen
NXP TechSupport
NXP TechSupport

Hi LARRY,

The bottom of the package provides the primary heat removal path, as well as excellent electrical grounding to the PCB through an exposed pad (EP).

Please check the application note AN1902 for more information.

4.2.2Thermal Electrical Pad Guidelines.jpg

Best Regards,

Robin

 

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Note: If this post answers your question, please click the Correct Answer button. Thank you!
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larryklotz
Contributor I

Thanks Robin.  This statement in Sec. 4.2.2 is the only place anywhere that states connecting the pad to circuit ground.

LK

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