Hello All,
Is there is simple way by which we can tell that controller is fine on production floor?
We can have some production fixtures which can tell some of product functionality is good.
we are looking some Hardware/software based test which make sure that NXP microcontroller is fine and not tampered.
Do we have some built in self test in this microcontroller?
We are using MK22FN1M0AVMC12 microcontroller.
RTOS is MQX 4.2
Thanks
Sudhanshu
已解决! 转到解答。
I am not sure that I got properly your questions
You can check the memory to confirm if the program was Flashed properly on the device, but if you want to check if the device was properly soldered on the PCBA you need to perform a functional test.
Normally the customer uses an ICT to check if the device is soldered properly, no solder short open pins, also on the ICT you can use the BSDL file to check the pins, depending if you have access to all the pin you can check if they have contact to the pcb.
After the ICT test normally, the customer performs a functional test, depending on your application and the time that you want to test the product is the coverage that you can have for the MCU features.
Other customers add some validation tests like thermal cycles in order to release the production line. Or cross-section on the device (K22) in order to check the proper solder of the BGA balls
You can add a final test (normally a random test, no 100% test) where you test the product like the final uses and if everything is correct you can release the batch of production
I hope this will help you
I am not sure that I got properly your questions
You can check the memory to confirm if the program was Flashed properly on the device, but if you want to check if the device was properly soldered on the PCBA you need to perform a functional test.
Normally the customer uses an ICT to check if the device is soldered properly, no solder short open pins, also on the ICT you can use the BSDL file to check the pins, depending if you have access to all the pin you can check if they have contact to the pcb.
After the ICT test normally, the customer performs a functional test, depending on your application and the time that you want to test the product is the coverage that you can have for the MCU features.
Other customers add some validation tests like thermal cycles in order to release the production line. Or cross-section on the device (K22) in order to check the proper solder of the BGA balls
You can add a final test (normally a random test, no 100% test) where you test the product like the final uses and if everything is correct you can release the batch of production
I hope this will help you