My understanding is that silicon vendors do not provide that information, how that UID is built up.
Background: It is as well my understanding that it contains date/time information, some kind of wafer identification, plus some kind of x and y coordinates on the wafer. So if you know the decoding, you can pick a roll of parts (assuming they are coming from consequent wafers) and you get the waver yield value (assuming the missing parts were bad parts), something usually Si vendors keep as a secret.
We had as the same challenge as you (how to reduce the number of bits of the UID). What we did: we used a roll of 1000 parts and checked out the UID numbers. From the numbers we identified the numbers which are always the same, and did not include these numbers in the 'unique vector generator'. This 'unique vector generator' then is stored as configuration data on the batch of devices to be used to create the new (smaller) UID. For every new batch of parts, this process is repeated and updated.
In another project, we are using an external SPI flash for storage: there we are using the unique ID of the flash device for the device unique ID, combined with the UID of the Kinetis.
I hope this helps,
Erich