How Freescale's RF device portfolio can solve problems for many different industries. The focus on uses outside of the traditional cellular infrastructure and how Freescale devices bring unique capabilities to these application areas that include: Industrial Scientific Medical (ISM) applications, including laser, MRI and heating; Land mobile, including public safety, dispatch and remote monitoring; Avionics, including communication, navigation and radar systems. Presented by Yan Vainter Presented at DwF Tel Aviv - January 27, 2015 Session ID: EUF-IND-T0977

Presented by Bin Zhang, Digi International

From head to sole, wearable technology has made the leap from early adoption to becoming a growing market that is on a trajectory to exceed the mobile phone. This session will focus on the broad requirements of wearable devices spanning from bare metal implementations to highly customized versions of Android. This session will give you an overview of the software developer's environment and the different choices that are currently available.

This session will explain how Freescale can enable customers to develop 76-81 GHz short and long range radar applications using the MPC577xK MCU, it will explain the concepts of the radar algorithms, including practical aspects such as SDADC or MIPI CSI sampling, Chirp Generation, Data Compression, R,V FFT, Detection and Tracking algorithms, and the benefits of the new Freescale IP that can allow them to improve their system resolution and accuracy. In this session customers will take away a detailed understanding of how to develop fast modulation radar systems using the MPC577xK MCU including the BOM cost advantages it also brings.

Performance requirements increase in order to process the massive amount of data coming from image and radar sensors, because when we ask electronic systems to take the place of the driver in a potential crash situation, the car BETTER BE safe, secure, reliable and dependable. Freescale ADAS solutions are designed from the outset to be ROBUST, EFFICIENT, and FLEXIBLE. The S32V234, is the first automotive vision SoC with the requisite reliability, safety and security measures to automate and co-pilot a self-aware car. Leveraging a host of automotive-grade technologies, the S32V takes the industry toward an era where cars can capture data, process it and actually share control with drivers in critical situations. This capability establishes the essential bridge from the current “assist” era toward the fully autonomous vehicles of tomorrow.

In this session, attendees will learn what types of applications can be built on a wearable reference platform for the healthcare and fitness markets. Design challenges and requirements for creating your own designs using WaRP, a wearable reference platform (WaRP), with Kinetis MCUs, i.MX applications processors and Freescale sensors will be discussed.

To help address the need for cost-effective vehicle electronic systems, the S12 MagniV mixed-signal microcontroller (MCU) portfolio offers highly integrated, single-chip solutions that are extremely reliable and easy to develop with, while helping reduce the bill of materials and overall manufacturing costs. The purpose of this session is to describe hardware design considerations when developing hardware for the MagniV family. It will cover topics such as clock generation, decoupling, voltage regulator and power considerations. Detailed reference design schematics and descriptions of the main components will be reviewed. Some general hardware recommendations will be provided as well.

Presented by LIANG PING Presented at DwF Kinetis MCUs Based on ARM® Technology Shenzhen - January 27, 2015

The standard CAN protocol has been extended into CAN Flexible Data (FD) to provide higher bandwidth while keeping the physical characteristics that have made it the most popular automotive in-vehicle communications protocol . This presentation will provide an overview of the changes to the standard as well as address the challenges faced while rolling out and implementing the technology.

In this hands-on workshop, we will walk you through examples and use cases of how to use the FlexIO feature on Kinetis MCUs to implement custom logic and enable additional serial interfaces.

In this session, we will first depict the revolutionary 2X faster go-to-market path to launch a device, then illustrate why MicroEJ for Kinetis helps to reduce the B.O.M cost of our customers. MicroEJ enables IoT innovation, reduces time to prototype and product, and also supports a dynamic Apps go-to-market strategy, by leveraging new capabilities such as ultra-fast simulation, prototyping, as well as product customization after deployment in the field driving larger market share for IoT OEMs.

During this session you will learn about the principal requirements of key classes of sensor applications, Freescale’s sensor portfolio and learn to help solve problems with Freescale sensors.

Presented by Lan Zhou from Landzo Presented at DwF Kinetis MCUs Based on ARM® Technology Shenzhen - January 27, 2015

This session will focus on the details of the programming model for the Advanced IO Processor (AIOP), including the scheduler, accelerators and memory scheme. We will also explain the architecture of AIOP software and ways to integrate it into applications.

In this session, we’ll take a look at how Micron is currently supporting the memory needs (DRAM, NAND, NOR, and SSD) of the automotive, industrial, medical, and military (AIMM) markets. Although memory is changing constantly and faster than ever, Micron understands that the AIMM markets require long product lifetimes as well as specific temperatures and package sizes. Learn more about how Micron is supporting these requirements by keeping a close eye on the latest market trends, technology, and interface roadmaps while offering a Product Longevity Program.

Learn about the latest MCUs recently added to the Kinetis V series, including the Kinetis KV5x MCU - Freescale's first MCU featuring the ARM Cortex-M7 core.

This session explains the many interfaces in the Freescale i.MX 6 series of application processors which make it ideal for automotive applications. 

This session will discuss a functional, cost and design cycle analysis of product development using SOMs, WaRP Board, custom board and SCM6D based products. This analysis will focus on several design scenarios facing customers and how each of the 4 solutions discussed compare. Further to the analysis will be discussion on time to market studies as well as software development impacts to product lead time. Following this class, you should be better prepared to utilize Freescale SCM portfolio to get your products to market faster.