This session will provide an update on Freescale's analog portfolio and value proposition. It will cover industrial, automotive and consumer product families: MCU and system power management, analog power switches, battery and energy management, physical layer interfaces such as Chokeless CAN and isolated network transceivers, radar 77GHz and motor control and power drive. It will highlight safety features of the products as well as new enablement tools such as Tower board or Processor Expert analog software component. Presented by Emmanuel Carcenac Presented at DwF Tel Aviv - January 27, 2015 Session ID: EUF-IND-T0662

Presented by Stanley Huang Presented at MCU and Automotive Solutions, Tianan - 19 March 2015

Freescale Connected Intelligence helps to bring the full potential of the IoT to life, delivering intelligence everywhere so designs and whole systems can scale and interact seamlessly and securely. This session will present the Freescale solutions addressing the challenges of IoT, with a focus on Wireless Connectivity platforms. Presented by Cyril Zarader Presented at DwF Tel Aviv - January 27, 2015 Session ID: EUF-IND-T0970

This session provides an introduction to the new QorIQ LS1 family, the first family of devices in the QorIQ LS series based on dual ARM® Cortex®-A7 cores. You will receive an overview of the LS1 processors--advantages, differentiators and capabilities for networking and industrial applications. Presented by Hao Sun Presented at DwF Digital Networking Shenzhen - January 28, 2015 Session ID: APF-NET-T0162

The most difficult step of the development cycle is moving from concept to prototype. The second is moving from prototype to production. Wearables are no exception. This class will first compare and contrast open source reference designs that are available to prototype wearable projects today. In the second half, using Freescale reference designs as a case study, we will cover the challenges and resources available to enable a project to move into manufacturing and production.

Presented by Jerry Zeng Presented at DwF Kinetis MCUs Based on ARM® Technology Shenzhen - January 27, 2015

A Deep Dive into Image Processing for i.MX 6 Series Applications Processors has no featured content yet. To feature content, go to the discussion, document, or blog post you want to feature and click "Feature this" in the list of actions on the right. Anyone with rights to administer content here may feature content.

In this workshop, we will dive deep into the advanced usage of the Kinetis Design Studio IDE, including how to use it with a version control system, automating builds and debug sessions. Also, learn how to generate coverage and profile your application.

Intelligent connected devices and consumer products are getting smaller and more feature rich thanks to awesome high-value microcontrollers like the i.MX 6 applications processors or K60 families. But with these powerful compact microcontrollers comes the challenge of interconnecting many peripherals, GPIOs and power onto ever shrinking printed circuit boards. In this session, embedded hardware developers will learn how to optimize the GPIO and peripheral pin assignments and save time and space in the PCB design - especially in getting the IO assignments into the schematics and PCB with a streamlined, controlled approach.

This session will cover some simple definitions of ESD and EOS while explaining the important differences in the energy involved and the resulting damage. The session will also review PCB design techniques for improving system robustness.

Dr. Todd Hubing of Clemson University shares his vast expertise regarding the impact of transmission line design on EMC performance of electronic control systems. In automotive systems, the wiring harnesses play a key role in coupling electronic noise to and from the components. Shielding and filtering the wiring harness and connector generally are not viable options, so it is important to address cable coupling issues with proper board-level design practices. This session will cover various cable-coupling mechanisms and grounding strategies. It also will include the options available at the board level for ensuring automotive components don't put excessive noise on the harness and that noise on the harness doesn't affect the proper operation of the component circuitry.

Kinetis Driver Libraries are foundations for all higher level software for Kinetis MCUs, making it even easier to develop MCU applications. This lecture and demo session will dive into the internals of the libraries exploring board configurations, clock management, the hardware abstraction layer, peripheral driver usage, the USB stack, RTOS integration and more. Presented by Li Sen and Chen Xinyu Presented at DwF Kinetis MCUs Based on ARM® Technology - Tianjin - 19 March 2015 Session ID: APF-DES-T1016

Kits include FRDM-34931S-EVB, FRDM-KL25Z, power supply, brushed DC motor and GUI on mbed™ site. We will show how to load and use a GUI from the mbed site to drive the motor, cover PEx software, and discuss the strengths of the MC34931S for industrial applications.

Accelerometers, Magnetometers, Gyroscopes, Pressure Sensors. Gathering sensor data at 400 samples per second, on 9 axes, results in 700 MB of data per day. This hands-on class will show what information is contained in sensor data and how to reduce the amount of recorded data dramatically without any major loss of targeted information. They will then compare data between dumb and intelligent data loggers, and understand the techniques used to compress the information.

This session will outline the design challenges that healthcare and medical device designers face when designing a product and selecting components. Special attention will be paid to IC selection, wireless connectivity, system security and regulatory concerns. Following this class, you should be better prepared to utilize Freescale products to get your products to market faster.

Introducing a temperature dependent current limit for motor drivers. This thermal management scheme ensures high efficient operation by reducing switching losses when motor is experiencing heavy loads or binding. In the presentation we will discuss factors determining power dissipation in a motor driver integrated circuit examining dynamic and steady state operation and their effect on junction temperature. We will review how to calculate an estimate of power dissipation using the information provided in a typical motor driver data sheet. With an understanding how power is dissipated in a motor driver, we will introduce a new system using temperature dependent current limit that will protect both the driver and the motor. Presented by Thomas Zemites Presented at DwF Silicon Valley - March 26, 2015 Session ID: AMF-IND-T0987

This session will discuss Advanced Driver Assistance Systems (ADAS) product and solution update plus feature guidelines on product mapping for different ADAS applications.

The material presented will focus on the basic principles and physics of electromagnetic energy.  It will be presented in easy to understand language with plenty of diagrams. Attendees will discover how understanding the behavior of EM fields can help to design PCBs that will be more robust and have better electromagnetic compatibality performance. This is not rocket science, but an easy to understand application of PCB geometry.