Android provides a powerful operating system and development environment that can be used to develop connected IoT products very quickly. It further allows developers build up feature-rich HMI solutions with multi-display capabilities, for example it allows dual full-HD HDMI operation on the DIGI ConnectCore 6 SOM. There is a risk that resulting embedded products are open to external attack or user modification. This presentation will discuss the key components of the Android operating system and show how to implement network-enabled embedded applications based on SE Android (Security Enhancements for Android), a completely open-source project that provides a sandboxed application runtime environment preventing unauthorized modification of devices and/or execution of potentially malicious code.

Automotive integrated circuits are requiring high temperature and high voltage application environments. High temperature and high voltage impose severe constraints on the design of IC interconnect and the materials used in the assembly and packaging processes. The use of fine gauge copper wire bonding has been growing very rapidly in consumer, portable, and industrial electronics. Freescale has made significant inroads in introducing and accelerating the adoption of fine gauge copper wire in the high reliability automotive space. The molding compounds were studied and reformulated to accommodate high voltage up to 65V. This presentation will discuss key learnings in copper wire bonding process and molding compound formulation development, and present an exciting update on Freescale strategy on gold to copper wire conversion.

This session provides an introduction to the new QorIQ LS1 family, the first family of devices in the QorIQ LS series based on dual ARM® Cortex®-A7 cores. You will receive an overview of the LS1 processors--advantages, differentiators and capabilities for networking and industrial applications. Presented by: You Peng

In this session, we will first depict the revolutionary 2X faster go-to-market path to launch a device, then illustrate why MicroEJ for Kinetis helps to reduce the B.O.M cost of our customers. MicroEJ enables IoT innovation, reduces time to prototype and product, and also supports a dynamic Apps go-to-market strategy, by leveraging new capabilities such as ultra-fast simulation, prototyping, as well as product customization after deployment in the field driving larger market share for IoT OEMs.

Presented by Bin Zhang, Digi International

Kinetis Driver Libraries are foundations for all higher level software for Kinetis MCUs, making it even easier to develop MCU applications. This lecture and demo session will dive into the internals of the libraries exploring board configurations, clock management, the hardware abstraction layer, peripheral driver usage, the USB stack, RTOS integration and more. Presented by Li Sen and Chen Xinyu Presented at DwF Kinetis MCUs Based on ARM® Technology - Tianjin - 19 March 2015 Session ID: APF-DES-T1016

Ethernet has become one of the most discussed technologies in automotive vehicle communications. This presentation will provide an overview of the standards encompassing Automotive Ethernet. As well as address the challenges in implementing the technology among different applications.

This session will provide an opportunity to view a demo with the QorIQ LS1021A Tower board. We will go over using CodeWarrior for Digital Networking ARM®-based products, learn how to use the Processor Expert for QCS tool to generate RCW, how to load up uboot and RCW to the Tower board, and gain experience with the SDK.

Network functions virtualization is promising to be a disruptive influence in the networking marketplace, leveraging software defined networking capabilities to virtualize network services that are currently carried out by dedicated special-purpose hardware. If successful, NFV will reduce operator dependencies on proprietary hardware and software, providing operators greater control over time-to-market, reduced cost structures and significantly lower operational costs. The market forces behind NFV will be examined and the NFV architecture will be introduced with particular attention paid to mapping of QorIQ LS series technology to anticipated NFV needs for greater levels of acceleration and offloads.

During this session you will learn about the principal requirements of key classes of sensor applications, Freescale’s sensor portfolio and learn to help solve problems with Freescale sensors.

In addition to fail safe system architectures, fault tolerance is gaining more and more importance in the context of highly-automated vehicles. This session addresses the theoretical foundations about fault tolerant system architectures and shows how those can be built with Freescale microcontrollers especially in the area of Advanced Driver Assistant Systems (ADAS). Leveraging key functional safety concepts built into Freescale's Automotive product portfolio enables efficient and scalable solutions spanning the range from fail safe systems to fault tolerant and fail operational architectures.

Presented by Istone Presented at DwF Digital Networking Shenzhen - January 28, 2015

Presented by Stanley Huang Presented at MCU and Automotive Solutions, Tianan - 19 March 2015

The Freescale RF Power Tool system is a customer enablement testing methodology that allows the lesser equipped RF design companies to easily and cost-effectively evaluate the latest Freescale RF power devices. The tool is an integral set of both an RF generator and a test fixture monitored by a wide variety of DC and RF sensors. In this class, we will cover the capabilities and limitations of the RF Power Tool system, dive into some of the options of available measurements, and list why those specific operating parameters which are most important to customers.

This session will focus on the details of the programming model for the Advanced IO Processor (AIOP), including the scheduler, accelerators and memory scheme. We will also explain the architecture of AIOP software and ways to integrate it into applications.

Presented by Jerry Zeng Presented at DwF Kinetis MCUs Based on ARM® Technology Shenzhen - January 27, 2015

There are many stakeholders in the development of cyber security for the automotive market ranging from car makers, Tier 1/Tier 2 suppliers, service providers, governments, and consumers. This leads to wide variety of requirements, market drivers, and use cases for automotive cyber security. This session will give an overview of these with a focus on the relationship between safety and security, the emerging SAE J3061 recommended practice, and the tradeoffs involved in implementing security features in the automobile. Sample cyber security both from Freescale and 3rd-party software providers will also be described.

To help address the need for cost-effective vehicle electronic systems, the S12 MagniV mixed-signal microcontroller (MCU) portfolio offers highly integrated, single-chip solutions that are extremely reliable and easy to develop with, while helping reduce the bill of materials and overall manufacturing costs. The purpose of this session is to describe hardware design considerations when developing hardware for the MagniV family. It will cover topics such as clock generation, decoupling, voltage regulator and power considerations. Detailed reference design schematics and descriptions of the main components will be reviewed. Some general hardware recommendations will be provided as well.