if you check the following link you can find all the package options for the S08AC devices,
https://www.nxp.com/products/processors-and-microcontrollers/additional-mpu-mcus-architectures/8-bit...
all of them are lead free I will take just as an example the MC9S08AC8MFGE that is a LQFP 44
on this link you will see that the peak of temperature is 260 C and this device is MLS 3
https://www.nxp.com/part/MC9S08AC8MFGE#/
so for the soldering we have the followin application note
https://www.nxp.com/docs/en/application-note/AN3300.pdf
Regarding to baking you need to follow the
IPC/JEDEC J-STD-033 Bake Conditions
and depending the package that you are using is the time and the temperature that you need to use
