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* Detailed Description:
*
* Example shows MCU's temperature measurement with the help of TSENS.
* Calibartion constants for TSENS0 and TSENS1 are read from Test Flash and
* ADC0/ADC1 is set to measure Vbg and TSENS outputs.
* Calculated internal temperature can be desplayed on the Terminal.
*
* EVB connection:
*
* Route LINFlexD_0 TXD/RXD (PB2/PB3) signals to the main board RS-232 transceiver
* Daughtercard:
* J17.11–12 ON .. Connect LINFlexD_0 TXD (PB2) to main board.
* J17.8–9 ON .. Connect LINFlexD_0 RXD (PB3) to main board.
*
* Motherboard
* J14 - SCI_RX ON
* J13 - SCI_TX ON
* J25 - SCI_PWR ON
*
* See results on PC terminal (19200, 8N1, None). You should get following text
* (with different values for sure)
*
* TSENS0/TSENS1 temperature measurement
* press any key to continue...
*
* Calibration constants read from Test Flash
*
* TSENS0 TSENS1
*
* K1 = 429 K1 = -220
* K2 = -5785 K2 = -5767
* K3 = -12800 K3 = -12736
* K4 = 45 K4 = 45
*
* K1 * Vbg_code * 2^-1 + K2 * TSENS_code * 2^3
* T = ------------------------------------------------------------------------- / 4 - 273.15 [degC]
* [K3 * Vbg_code * 2^2 + K4 * TSENS_code] * 2^-10
*
* Vbg0_code = 1502 Vbg1_code = 1502
* TSENS0_code = 2002 TSENS1_code = 1988
*
* TSENS0 temp = 34.57 degC TSENS1 temp = 36.78 degC
*
* ------------------------------------------------------------------------------
* Test HW: MPC57xx
* Maskset: 1N65H
* Target : RAM, internal_FLASH
* Fsys: 200 MHz PLL with 40 MHz crystal reference
* Terminal: 19200, 8N1, None
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