Basically, the best approach - to use simulation technique for PCB design.
In the same time, general rules may be provided for customers to simplify their
PCB considerations, but note, for assurance such rules are very strong.
So, if You can simulate the PCB design please use it, if cannot - please follow
general (and more strong) recommendations. To avoid signal overshooting, please
try to apply different drive strength options for both i.MX25 and DDR2 part. In particular,
section 1.3 (Calculating the Characteristic Impedance) of app note AN3963 shows how to
estimate it. Also one can apply to JEDEC recommendations for DIMM / SODIMM (termination)
schemes.
Finally, please refer to section 3 (mDDR and DDR2 Routing Guidelines) of AN4017.
Below are app note links :
http://cache.freescale.com/files/dsp/doc/app_note/AN3963.pdf
http://cache.freescale.com/files/dsp/doc/app_note/AN4017.pdf
Have a great day,
Yuri
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