Hi Olle
one can try to test on NXP reference board, i.MX8M EVK with Demo Images on below link
and compare results with custom board. With a small form factor and low copper content,
compared with reference board, on custom board board heat dissipation can be issue.
Linux Binary Demo Files - i.MX 8MQuad EVK
Schematics
Design Files for the i.MX 8M Evaluation Kit (EVK)
i.MX 8M Evaluation Kit|NXP
Some figures can be found in AN12118 i.MX8M Quad Power Consumption Measurement,
Coremark test, about 2W dissipation, die temperature = 60C, ambient temperature = 25 C.
KANZI test, about 3W dissipation die temperature = 67C, ambient temperature = 26 C.
https://www.nxp.com/docs/en/nxp/application-notes/AN12118.pdf
Note, current greatly depends on temperature as described in
AN5381 Measuring Current in i.MX Applications sect.6.2. Current vs. ambient temperature
https://www.nxp.com/docs/en/application-note/AN5381.pdf
AN4579 Thermal Management Guidelines shows various thermal solutions
https://www.nxp.com/docs/en/application-note/AN4579.pdf
Best regards
igor
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