NXP amplifier, TDF8546TH / N2ZJ, seeking instructions for chip baking process

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NXP amplifier, TDF8546TH / N2ZJ, seeking instructions for chip baking process

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Contributor I

Dear NXP,

TDF8546TH / N2ZJ, its humidity sensitivity is 3, chip thickness is 3.3mm. We need to perform the baking process before placement, but we don't know the specific operation steps, so we need to confirm. Such as how many hours after the tray is unpacked, the temperature of the chip baking, and the baking time.
Is there any relevant documentation, looking forward to your reply.
thank you!
Best Regards,
Owen
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NXP TechSupport
NXP TechSupport

Hi 天泉 成

one can refer to JEDEC Test Method A112, A113 Electronic Industry Alliance documents,

also additional document was sent via mail.

Best regards
igor
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Contributor I

Hi Igor,

Thank you for your suppor!
Best Regards
Owen
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