Maximum force for applying heatsink

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Maximum force for applying heatsink

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jeroenvanandel
Contributor I

What is the maximum force for the following components:

i.MX8M Mini/nano in FCPBGA486 package

i.MX8M Plus in LFBGA548 package

PMIC:  PCA9450CHNY & PCA9450AAHNY:  56 HVQFN  package 

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June_Lu
NXP TechSupport
NXP TechSupport

From the Table 5 in AN4871, the average pressure on the FCBGA package is around 0.03 lb/mm2.

The max force for i.MX8M Mini/nano in FCBGA486 package 14x14mm is 5 lbs(0.03 x 14 x 14).

i.MX8M Plus in FCBGA548 package, 15 x 15 mm, is around 6lbs(0.03 x 15 x 15).

For the PMIC parameters, please create case in the https://community.nxp.com/t5/Power-Management/bd-p/Power-Management

Thanks

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