As of February 2, 2026, the NXP MEMS Sensor products have been transferred to STMicroelectronics. For details on the transferred products, see this page. Please reach out to STMicroelectronics for further information.
The use of a No-Clean (NC) flux is recommended for exposed cavity components. Using pressure spray or other methods of cleaning is not recommended. If cleaning of the pcb is performed Water Soluble (WS) flux can be used, but it is recommended the component cavity to be protected by adhesive Kapton tape, vinyl cap or other means prior to the cleaning process to prevent contamination and foreign materials from being introduced into device cavity as result of cleaning processes.
