As I understand your concern was/is the overshoots at the T1042 output pins, right? The last waveform shows that the overshoots are absent at the die, so the silicon is not affected and overvoltage can not damage the device.
And I do not understand your last question "...physically how can i take the signal directly from the die when i have a ball package". What is the task you are trying to solve?
Regards,
Bulat