MC33GD3000 Power dissipation profiles

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MC33GD3000 Power dissipation profiles

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TomLightning
Contributor III

Hi,

I have a question related to the figure about the power dissipation of the MC33GD3000 shown in the datasheet:

image.png

Is it right, that the power dissipation is given in ohms or should it be given in watts?

BR

Tom

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TomasVaverka
NXP TechSupport
NXP TechSupport

Hi Tom,

You are right, it should be given in watts.

Thank you for pointing that out, we will correct it in the next datasheet revision.

Best regards,

Tomas

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TomLightning
Contributor III

Okay, that makes more sense. The thermal resistance from the exposed pad to the junction (internal chip structure) is give with 3°C/W acc. datasheet. Let's assume that the ground plane which is directly connected to the exposed pad has a temperature of +125°C. Is the assumption right, that my junction temperature would only increase about approx. 3°C at 1W power dissipation? I'm trying to find out if I could get a thermal problem when operating the MC33GD3000 with the battery supply.

BR

Tom

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