PCN 201803021F01

[gerhardkramer]

PCN 201803021F01 describes a change in molding process. Our application of MPC8255 is flight critical for avionics.

Are there new qualification activities of our product necessary? Is there a proposal what has to be requalified? e.g. Temperature tests, vibration tests

Is there any additional risk when using processors with new molding process?

Thank you in advance

Gerhard

[andrei_skok]

According to the PCN:

No impact on form, fit, function, reliability or quality.

Case outline spec is maintained while providing a more dimensionally uniform product. This will be observed as a flatter surface with uniform color.

Center Gate Mold PQ2 devices were fully qualified and did not show any difference with the existing Glob Top PQ2 devices. If you want to have Center Gate Mold PQ2 Qualification report please open the Support Case.

To open the Case please register/sign-in on the NXP WEB nxp.com, "Account" button.
Choose "Support" -> "All support options" and then "Go to Tickets". Here you can open new Technical Support Case.