NXP does not provide recommended reflow profiles for good soldering -- NXP recommends customers obtain best profiles from their solder paste vendors. The "reflow profiles" that NXP uses in stressing / qual are much higher in temperature and longer in duration than typically makes good solder joints. Our profiles are intended to STRESS the component and thus are worst-case conditions, not ideal conditions for soldering (profiles used for stressing, because of high temp and long times would tend to dry out flux compared with actual optimized profiles that a solder paste vendor would likely recommend).
MPC8541 has FC-PBGA package so the following presentation can be used for more infromation: (slides 23-25)
https://www.nxp.com/docs/en/package-information/FC-PBGAPRES.pdf
Have a great day,
Andrei
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