Thanks for your answer,
Another question I have is about the stackup. There is a contradiction between the BRD file and MX8MMHDG.pdf.
In the BRD file the copper thickness is 1Oz but in hardware design guide it is 0.5oz. the problem is that there are 3mils traces on those layers. Hows did manage to manufacture it? Can I build the stackup with 0.5oz?